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BZV55C24

产品描述Zener Diode, 24V V(Z), 5%, 0.4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS PACKAGE-2
产品类别分立半导体    二极管   
文件大小117KB,共3页
制造商SPC Multicomp
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BZV55C24概述

Zener Diode, 24V V(Z), 5%, 0.4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS PACKAGE-2

BZV55C24规格参数

参数名称属性值
厂商名称SPC Multicomp
包装说明HERMETIC SEALED, GLASS PACKAGE-2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JESD-30 代码O-LELF-R2
元件数量1
端子数量2
最高工作温度200 °C
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
极性UNIDIRECTIONAL
最大功率耗散0.4 W
标称参考电压24 V
表面贴装YES
技术ZENER
端子形式WRAP AROUND
端子位置END
最大电压容差5%
工作测试电流5 mA

文档预览

下载PDF文档
Zener Diode
Silicon Planar Zener Diodes
Feature:
Hermetically sealed, glass silicon diodes.
Absolute Maximum Ratings (T
a
=25°C)
Description
Average Forward Current (averaged Over any 20 ms period)
Repetitive Peak Forward Current
Total Power Dissipation up to T
flange
= 50ºC
Up to T
a
= 50ºC and Mounted on a Ceramic Substrate of 10mm x
10mm x 0.6mm
Non-Repetitive Peak Reverse Power Dissipation t = 100µs,
T
j
= 150ºC
Storage Temperature
Junction Temperature
Thermal Resistance
From Junction to tie-point (flanges)
From Junction to Ambient when Mounted on a Ceramic Substrate
of 10mm x 10mm x 0.6mm
R
th (j-tp)
R
th (j-a)
0.3
0.38
K/mW
Symbol
I
F(av)
I
FRM
P
tot
P
tot
P
ZSM
T
stg
T
j
Value
250
250
500
400
30
- 65 to +200
200
mW
Unit
mA
W
ºC
Page 1
25/04/08 V1.1

BZV55C24相似产品对比

BZV55C24 BZV55C11 BZV55C47 BZV55C43 BZV55C5V6 BZV5530 BZV55C6V2
描述 Zener Diode, 24V V(Z), 5%, 0.4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS PACKAGE-2 Zener Diode, 11V V(Z), 5%, 0.4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS PACKAGE-2 Zener Diode, 47V V(Z), 5%, 0.4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS PACKAGE-2 Zener Diode, 43V V(Z), 5%, 0.4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS PACKAGE-2 Zener Diode, 5.6V V(Z), 5%, 0.4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS PACKAGE-2 Zener Diode, 30V V(Z), 5%, 0.4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS PACKAGE-2 Zener Diode, 6.2V V(Z), 5%, 0.4W, Silicon, Unidirectional, HERMETIC SEALED, GLASS PACKAGE-2
厂商名称 SPC Multicomp SPC Multicomp SPC Multicomp SPC Multicomp SPC Multicomp SPC Multicomp SPC Multicomp
包装说明 HERMETIC SEALED, GLASS PACKAGE-2 O-LELF-R2 O-LELF-R2 O-LELF-R2 O-LELF-R2 O-LELF-R2 O-LELF-R2
针数 2 2 2 2 2 2 2
Reach Compliance Code unknown unknown unknown unknown unknown unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
外壳连接 ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED
配置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
二极管元件材料 SILICON SILICON SILICON SILICON SILICON SILICON SILICON
二极管类型 ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE
JESD-30 代码 O-LELF-R2 O-LELF-R2 O-LELF-R2 O-LELF-R2 O-LELF-R2 O-LELF-R2 O-LELF-R2
元件数量 1 1 1 1 1 1 1
端子数量 2 2 2 2 2 2 2
最高工作温度 200 °C 200 °C 200 °C 200 °C 200 °C 200 °C 200 °C
封装主体材料 GLASS GLASS GLASS GLASS GLASS GLASS GLASS
封装形状 ROUND ROUND ROUND ROUND ROUND ROUND ROUND
封装形式 LONG FORM LONG FORM LONG FORM LONG FORM LONG FORM LONG FORM LONG FORM
极性 UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL
最大功率耗散 0.4 W 0.4 W 0.4 W 0.4 W 0.4 W 0.4 W 0.4 W
标称参考电压 24 V 11 V 47 V 43 V 5.6 V 30 V 6.2 V
表面贴装 YES YES YES YES YES YES YES
技术 ZENER ZENER ZENER ZENER ZENER ZENER ZENER
端子形式 WRAP AROUND WRAP AROUND WRAP AROUND WRAP AROUND WRAP AROUND WRAP AROUND WRAP AROUND
端子位置 END END END END END END END
最大电压容差 5% 5% 5% 5% 5% 5% 5%
工作测试电流 5 mA 5 mA 2 mA 2 mA 2 mA 2 mA 2 mA

 
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