|
SN74AUC2G66DCUR |
SN74AUC2G66DCTR |
SN74AUC2G66YZPR |
SN74AUC2G66DCURE4 |
SN74AUC2G66DCURG4 |
| 描述 |
Dual Bilateral Analog Switch 8-VSSOP -40 to 85 |
Dual Bilateral Analog Switch 8-SM8 -40 to 85 |
Dual Bilateral Analog Switch 8-DSBGA -40 to 85 |
Dual Bilateral Analog Switch 8-VSSOP -40 to 85 |
Dual Bilateral Analog Switch 8-VSSOP -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| 是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
| 是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
| 厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
| 零件包装代码 |
SOIC |
SOIC |
BGA |
SOIC |
SOIC |
| 包装说明 |
VSSOP-8 |
SSOP-8 |
DSBGA-8 |
VSSOP, TSSOP8,.12,20 |
VSSOP, TSSOP8,.12,20 |
| 针数 |
8 |
8 |
8 |
8 |
8 |
| Reach Compliance Code |
compliant |
compliant |
compliant |
compli |
compli |
| Factory Lead Time |
6 weeks |
1 week |
1 week |
6 weeks |
6 weeks |
| ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
- |
- |
| 模拟集成电路 - 其他类型 |
SPST |
SPST |
SPST |
- |
- |
| 标称带宽 |
500 MHz |
500 MHz |
500 MHz |
- |
- |
| JESD-30 代码 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PBGA-B8 |
- |
- |
| JESD-609代码 |
e4 |
e4 |
e1 |
- |
- |
| 长度 |
2.3 mm |
2.95 mm |
1.9 mm |
- |
- |
| 湿度敏感等级 |
1 |
1 |
1 |
- |
- |
| 正常位置 |
NO |
NO |
NO |
- |
- |
| 信道数量 |
1 |
1 |
1 |
- |
- |
| 功能数量 |
2 |
2 |
2 |
- |
- |
| 端子数量 |
8 |
8 |
8 |
- |
- |
| 标称断态隔离度 |
50 dB |
50 dB |
50 dB |
- |
- |
| 通态电阻匹配规范 |
3 Ω |
3 Ω |
3 Ω |
- |
- |
| 最大通态电阻 (Ron) |
40 Ω |
40 Ω |
40 Ω |
- |
- |
| 最高工作温度 |
85 °C |
85 °C |
85 °C |
- |
- |
| 最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
- |
- |
| 输出 |
COMMON OUTPUT |
COMMON OUTPUT |
COMMON OUTPUT |
- |
- |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
- |
| 封装代码 |
VSSOP |
LSSOP |
VFBGA |
- |
- |
| 封装等效代码 |
TSSOP8,.12,20 |
SSOP8,.16 |
BGA8,2X4,20 |
- |
- |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
- |
| 封装形式 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
- |
- |
| 峰值回流温度(摄氏度) |
260 |
260 |
260 |
- |
- |
| 电源 |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
- |
- |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
- |
- |
| 座面最大高度 |
0.9 mm |
1.3 mm |
0.5 mm |
- |
- |
| 最大供电电流 (Isup) |
0.01 mA |
0.01 mA |
0.01 mA |
- |
- |
| 最大供电电压 (Vsup) |
2.7 V |
2.7 V |
2.7 V |
- |
- |
| 最小供电电压 (Vsup) |
0.8 V |
0.8 V |
0.8 V |
- |
- |
| 标称供电电压 (Vsup) |
1.1 V |
1.1 V |
1.1 V |
- |
- |
| 表面贴装 |
YES |
YES |
YES |
- |
- |
| 最长断开时间 |
4 ns |
4 ns |
4 ns |
- |
- |
| 最长接通时间 |
3 ns |
3 ns |
3 ns |
- |
- |
| 切换 |
MAKE-BEFORE-BREAK |
MAKE-BEFORE-BREAK |
MAKE-BEFORE-BREAK |
- |
- |
| 技术 |
CMOS |
CMOS |
CMOS |
- |
- |
| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
- |
| 端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
- |
- |
| 端子形式 |
GULL WING |
GULL WING |
BALL |
- |
- |
| 端子节距 |
0.5 mm |
0.65 mm |
0.5 mm |
- |
- |
| 端子位置 |
DUAL |
DUAL |
BOTTOM |
- |
- |
| 处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
- |
| 宽度 |
2 mm |
2.8 mm |
0.9 mm |
- |
- |
| Base Number Matches |
1 |
1 |
1 |
- |
- |