3-Line to 8-Line Decoder / Demultiplexer 16-PDIP -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 其他特性 | 3 ENABLE INPUTS |
| 系列 | AHCT/VHCT/VT |
| 输入调节 | STANDARD |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e4 |
| 长度 | 19.3 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 最大I（ol） | 0.008 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 0.04 mA |
| Prop。Delay @ Nom-Su | 12 ns |
| 传播延迟（tpd） | 13 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.35 mm |
| Base Number Matches | 1 |
| SN74AHCT138N | SN74AHCT138RGYR | SN74AHCT138DBR | SN74AHCT138NSR | SN74AHCT138D | SN74AHCT138DGVR | ARS5024 | |
|---|---|---|---|---|---|---|---|
| 描述 | 3-Line to 8-Line Decoder / Demultiplexer 16-PDIP -40 to 85 | 3-Line to 8-Line Decoder / Demultiplexer 16-VQFN -40 to 85 | 3-Line to 8-Line Decoder / Demultiplexer 16-SSOP -40 to 85 | 3-Line to 8-Line Decoder / Demultiplexer 16-SO -40 to 85 | 3-Line to 8-Line Decoder / Demultiplexer 16-SOIC -40 to 85 | 3-Line to 8-Line Decoder / Demultiplexer 16-TVSOP -40 to 85 | Transient Voltage Suppressor for Automobile Button |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 零件包装代码 | DIP | QFN | SOIC | SOIC | SOIC | SOIC | - |
| 包装说明 | DIP, DIP16,.3 | HVQCCN, LCC16/20,.14X.16,20 | SSOP, SSOP16,.3 | SOP, SOP16,.3 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25,16 | - |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | - |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week | - |
| 其他特性 | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | - |
| 系列 | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT/VT | - |
| 输入调节 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | - |
| JESD-30 代码 | R-PDIP-T16 | R-PQCC-N16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | - |
| 长度 | 19.3 mm | 4 mm | 6.2 mm | 10.2 mm | 9.9 mm | 3.6 mm | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | - |
| 最大I（ol） | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | - |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | DIP | HVQCCN | SSOP | SOP | SOP | TSSOP | - |
| 封装等效代码 | DIP16,.3 | LCC16/20,.14X.16,20 | SSOP16,.3 | SOP16,.3 | SOP16,.25 | TSSOP16,.25,16 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 包装方法 | TUBE | TR | TR | TR | TUBE | TR | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 最大电源电流（ICC） | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | - |
| Prop。Delay @ Nom-Su | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | - |
| 传播延迟（tpd） | 13 ns | 13 ns | 13 ns | 13 ns | 13 ns | 13 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 5.08 mm | 1 mm | 2 mm | 2 mm | 1.75 mm | 1.2 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | NO | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | THROUGH-HOLE | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 2.54 mm | 0.5 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.4 mm | - |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 6.35 mm | 3.5 mm | 5.3 mm | 5.3 mm | 3.91 mm | 4.4 mm | - |
| Base Number Matches | 1 | 1 | 1 | - | 1 | 1 | - |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 湿度敏感等级 | - | 2 | 1 | 1 | 1 | 1 | - |
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