IC,LOGIC MUX,SINGLE,8-INPUT,TTL,FP,20PIN,CERAMIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | DFP, FL20,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDFP-F20 |
JESD-609代码 | e0 |
逻辑集成电路类型 | MULTIPLEXER |
最大I(ol) | 0.016 A |
功能数量 | 1 |
输入次数 | 8 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DFP |
封装等效代码 | FL20,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
最大电源电流(ICC) | 33 mA |
Prop。Delay @ Nom-Sup | 43 ns |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
DM7211W | DM8210J | DM8210N | DM8210W | DM8211J | DM8211N | DM8211W | DM7210J | DM7210W | DM7211J | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,FP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,PLASTIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,FP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,PLASTIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,FP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,FP,20PIN,CERAMIC | IC,LOGIC MUX,SINGLE,8-INPUT,TTL,DIP,20PIN,CERAMIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DFP, FL20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDFP-F20 | R-XDIP-T20 | R-PDIP-T20 | R-XDFP-F20 | R-XDIP-T20 | R-PDIP-T20 | R-XDFP-F20 | R-XDIP-T20 | R-XDFP-F20 | R-XDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
最大I(ol) | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DFP | DIP | DIP | DFP | DIP | DIP | DFP | DIP | DFP | DIP |
封装等效代码 | FL20,.3 | DIP20,.3 | DIP20,.3 | FL20,.3 | DIP20,.3 | DIP20,.3 | FL20,.3 | DIP20,.3 | FL20,.3 | DIP20,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
最大电源电流(ICC) | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA | 33 mA |
Prop。Delay @ Nom-Sup | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns | 43 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | NO | NO | YES | NO | NO | YES | NO | YES | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
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