Speech Synthesizer With RCDG, 180s, CMOS, PBGA19, CSP-19
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Nuvoton(新唐科技) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA19,4X5,30 |
| 针数 | 19 |
| Reach Compliance Code | compliant |
| 商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG |
| JESD-30 代码 | R-PBGA-B19 |
| JESD-609代码 | e0 |
| 长度 | 6.1 mm |
| 功能数量 | 1 |
| 端子数量 | 19 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA19,4X5,30 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3 V |
| 认证状态 | Not Qualified |
| 最长读取时间 | 180 s |
| 座面最大高度 | 0.85 mm |
| 最大压摆率 | 40 mA |
| 最大供电电压 (Vsup) | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | BALL |
| 端子节距 | 0.75 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.7 mm |
| ISD4002-180Z | ISD4002-120X | ISD4002-120Z | ISD4002-120ZI | ISD4002-150Z | ISD4002-180X | ISD4002-240X | ISD4002-240ZD | ISD4002-240SI | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Speech Synthesizer With RCDG, 180s, CMOS, PBGA19, CSP-19 | Speech Synthesizer With RCDG, 120s, CMOS, DIE-19 | Speech Synthesizer With RCDG, 120s, CMOS, PBGA19, CSP-19 | Speech Synthesizer With RCDG, 120s, CMOS, PBGA19, CSP-19 | Speech Synthesizer With RCDG, 150s, CMOS, PBGA19, CSP-19 | Speech Synthesizer With RCDG, 180s, CMOS, DIE-19 | Speech Synthesizer With RCDG, 240s, CMOS, DIE-19 | Speech Synthesizer With RCDG, 240s, CMOS, PBGA19, CSP-19 | Speech Synthesizer With RCDG, 240s, CMOS, PDSO28, |
| 厂商名称 | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) | Nuvoton(新唐科技) |
| 零件包装代码 | BGA | DIE | BGA | BGA | BGA | DIE | DIE | BGA | SOIC |
| 包装说明 | VFBGA, BGA19,4X5,30 | DIE, | VFBGA, BGA19,4X5,30 | VFBGA, BGA19,4X5,30 | VFBGA, BGA19,4X5,30 | DIE, | DIE, | VFBGA, | SOP, SOP28,.4 |
| 针数 | 19 | 19 | 19 | 19 | 19 | 19 | 19 | 19 | 28 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG |
| JESD-30 代码 | R-PBGA-B19 | R-XUUC-N19 | R-PBGA-B19 | R-PBGA-B19 | R-PBGA-B19 | R-XUUC-N19 | R-XUUC-N19 | R-PBGA-B19 | R-PDSO-G28 |
| 端子数量 | 19 | 19 | 19 | 19 | 19 | 19 | 19 | 19 | 28 |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | DIE | VFBGA | VFBGA | VFBGA | DIE | DIE | VFBGA | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | UNCASED CHIP | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | UNCASED CHIP | UNCASED CHIP | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最长读取时间 | 180 s | 120 s | 120 s | 120 s | 150 s | 180 s | 240 s | 240 s | 240 s |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | NO LEAD | BALL | BALL | BALL | NO LEAD | NO LEAD | BALL | GULL WING |
| 端子位置 | BOTTOM | UPPER | BOTTOM | BOTTOM | BOTTOM | UPPER | UPPER | BOTTOM | DUAL |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - |
| 长度 | 6.1 mm | - | 6.1 mm | 6.1 mm | 6.1 mm | - | - | 6.1 mm | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 最高工作温度 | 70 °C | 50 °C | 70 °C | 85 °C | 70 °C | 50 °C | 50 °C | - | 85 °C |
| 封装等效代码 | BGA19,4X5,30 | - | BGA19,4X5,30 | BGA19,4X5,30 | BGA19,4X5,30 | - | - | - | SOP28,.4 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 3 V | - | 3 V | 3 V | 3 V | - | - | - | 3 V |
| 座面最大高度 | 0.85 mm | - | 0.85 mm | 0.85 mm | 0.85 mm | - | - | 0.85 mm | - |
| 最大压摆率 | 40 mA | - | 40 mA | 40 mA | 40 mA | - | - | - | 40 mA |
| 最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - |
| 端子节距 | 0.75 mm | - | 0.75 mm | 0.75 mm | 0.75 mm | - | - | 0.75 mm | 1.27 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 4.7 mm | - | 4.7 mm | 4.7 mm | 4.7 mm | - | - | 4.7 mm | - |
微控制器 MCU
ADI参考电路
聊聊、笑笑、闹闹
嵌入式系统
聊聊、笑笑、闹闹
淘e淘
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
