REVISIONS
LTR
A
DESCRIPTION
Correction to TABLE I, I
DD
parameter. Added Appendix B to allow for
the procurement of die. - glg
Correction to Appendix B, added paragraph 10.2.4 Die code. Updated
boilerplate references. ksr
Add 02 device representing an extended temperature device.
Corrected (SEP) effective with no latch-up in paragraph 1.5; was 90.5
MeV-cm
2
/mg changed to 80 MeV-cm
2
/mg ksr
Added devices 03 and 04, updated Table I.
ksr
DATE (YR-MO-DA)
00-12-11
APPROVED
Raymond Monnin
B
02-01-15
Raymond Monnin
C
02-10-22
Raymond Monnin
D
E
02-12-08
07-03-29
Raymond Monnin
Robert M. Heber
Added devices 05 and 06 updated Table I. Added case outline Y.
Boilerplate update, part of 5 year review. ksr
Corrected Table I, the post radiation limit for I
DD2
for devices 05 and
06. ksr
Made corrections to case U dimension table symbol A, D, E1, and E2.
ksr
F
G
07-04-11
09-09-24
Robert M. Heber
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
G
35
G
15
G
36
G
16
G
37
G
17
G
38
G
18
REV
SHEET
PREPARED BY
Gary L. Gross
CHECKED BY
Jeff Bowling
G
19
G
20
G
21
G
1
G
22
G
2
G
23
G
3
G
24
G
4
G
25
G
5
G
26
G
6
G
27
G
7
G
28
G
8
G
29
G
9
G
30
G
10
G
31
G
11
G
32
G
12
G
33
G
13
G
34
G
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
Raymond Monnin
DRAWING APPROVAL DATE
00-09-19
REVISION LEVEL
G
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, 512K x 8-BIT, RADIATION-
HARDENED SRAM, MONOLITHIC
SILICON
SIZE
A
SHEET
AMSC N/A
CAGE CODE
67268
1 OF
38
5962-00536
5962-E222-09
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing documents three product assurance class levels consisting of high reliability (device classes Q and
M), space application (device class V), and for appropriate satellite and similar applications (device class T). A choice of case
outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of
Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class T, the user is encouraged to review the
manufacturers Quality Management (QM) plan as part of their evaluation of these parts and their acceptability in the intended
application.
1.2 PIN. The PIN shall be as shown in the following example:
5962
L
00536
01
T
X
C
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
1.2.1 RHA designator. Device classes Q, T and V RHA marked devices shall meet the MIL-PRF-38535 specified RHA levels
and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535 appendix
A specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types shall identify the circuit function as follows:
Device type
01
02
03
04
05
06
Generic number 1/
9Q512
9Q512
9Q512
9Q512
9Q512E
9Q512E
Circuit function
512K X 8-bit Radiation-hardened SRAM (MIL Temp)
512K X 8-bit Radiation-hardened SRAM (Extended Temp)
512K X 8-bit Radiation-hardened SRAM (MIL Temp)
512K X 8-bit Radiation-hardened SRAM (Extended Temp)
512K X 8-bit Radiation-hardened SRAM (MIL Temp)
512K X 8-bit Radiation-hardened SRAM (Extended Temp)
Access time
25 ns
25 ns
20 ns
20 ns
20 ns
20 ns
1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Q, V
T
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Certification and qualification to MIL-PRF-38535 with performance as specified
in the device manufacturers approved quality management plan
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
U
X
Y
Descriptive designator
See figure 1
See figure 1
See figure 1
Terminals
36
36
36
Package style
Flat pack
Flat pack
Flat pack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38535 for classes Q, T and V or MIL-PRF-38535,
appendix A for device class M.
__________
__
1/ Generic numbers are also listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document
and will also be listed in QML-38535 and MIL-HDBK-103.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-00536
SHEET
2
1.3 Absolute maximum ratings. 2/ 3/
Supply voltage range, (V
DD
) .................................................................................
Voltage range on any input pin ............................................................................
Voltage range on any output pin ..........................................................................
Input current, dc ...................................................................................................
Power dissipation .................................................................................................
Case temperature range, (T
C
) (Devices 01, 03, and 05) ....................................
Case temperature range, (T
C
) (Devices 02, 04, and 06) ....................................
Storage temperature range, (T
STG
) ......................................................................
Junction temperature, (T
J
) ...................................................................................
Thermal resistance, junction-to-case, (
JC
): Case X and U .................................
1.4 Recommended operating conditions.
Supply voltage range, (V
DD
) .................................................................................
Supply voltage, (V
SS
) ...........................................................................................
Input voltage, dc...................................................................................................
Case temperature, (T
C
) (Devices 01, 03, and 05) ..............................................
Case temperature, (T
C
) (Devices 02, 04, and 06) ..............................................
1.5 Radiation features
Maximum total dose available (dose rate = 50 - 300 rads(Si)/s) ..........................
Dose rate upset ...................................................................................................
Dose rate survivability .........................................................................................
Single event phenomenon (SEP) effective
linear energy threshold (LET) with no upsets (Devices 01, 02, 03, and 04).......
(Devices 05 and 06) ...................
with no latch-up
4
> 5.0x 10 rads(Si)
4/
4/
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
+ 10 mA
1.0 W
-55°C to +125°C
-40°C to +125°C
-65°C to +150°C
+150°C
+10°C/W
+4.5 V dc to +5.5 V dc
0 V dc
0 V dc to V
DD
-55°C to +125°C
-40°C to +125°C
> 1 MeV-cm
2
/mg 5/
> 2.8 MeV-cm
2
/mg 6/
(Devices 01, 02, 03, and 04) ...... > 80 MeV-cm
2
/mg 5/
(Devices 05 and 06) ................... > 110 MeV-cm
2
/mg 6/
Neutron irradiation ............................................................................................... 4/
1.6 Digital logic testing for device classes T, Q, and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) ......................................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
100 percent
____________
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/ All voltage values in this drawing are with respect to V
SS
.
4/ When a value is determined per customer requirements, it shall be provided.
5/ Contact the device manufacturer for detailed lot information.
6/ Limits are guaranteed by design or process, but not production tested unless specified by the customer through purchase
order or contract.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
A
REVISION LEVEL
G
5962-00536
SHEET
3
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or from the Standardization Document
Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192
-
Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to:
ASTM International, PO Box C700, 100 Barr
Harbor Drive, West Conshohocken, PA 19428-2959;
http://www.astm.org.)
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
22201;
http://www.jedec.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the
documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless
a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q, T and V shall be in accordance with MIL-PRF-
38535, and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in
the QM plan shall not effect the form, fit, or function as described herein. The individual item requirements for device class M
shall be in accordance with MIL-PRF-38535, appendix A and as specified herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix B to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q, T and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 and figure 1 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Output load circuit. The output load circuit shall be as specified on figure 4.
3.2.5 Timing waveforms. The timing waveforms shall be as specified on figure 5.
3.2.6 Radiation test circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision
control and shall be made available to the preparing and acquiring activity upon request.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-00536
SHEET
4
3.2.7 Functional tests. Various functional tests used to test this device are contained in appendix A. If the test patterns
cannot be implemented due to test equipment limitations, alternate test patterns to accomplish the same results shall be allowed.
For device class M, alternate test patterns shall be maintained under document revision level control by the manufacturer and
shall be made available to the preparing or acquiring activity upon request. For device classes Q, T and V, alternate test
patterns shall be under the control of the device manufacturer’s Technology Review Board (TRB) in accordance with MIL-PRF-
38535 and shall be made available to the preparing or acquiring activity upon request.
3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post-irradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q, T, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall
be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q, T and V shall be a "QML" or "Q" as required
in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q, T and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q, T and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q, T and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 41 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
For device class T, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 and the device
manufacturer's QM plan, including screening, qualification, and conformance inspection. The performance envelope and
reliability information shall be as specified in the manufacturers QM plan.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-00536
SHEET
5
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