Shift Register, 1024-Bit, MOS, MBCY8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Msis Semiconductor Inc |
包装说明 | , CAN8,.2 |
Reach Compliance Code | unknown |
JESD-30 代码 | O-MBCY-W8 |
JESD-609代码 | e0 |
最大频率@ Nom-Sup | 5000000 Hz |
位数 | 1024 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | METAL |
封装等效代码 | CAN8,.2 |
封装形状 | ROUND |
封装形式 | CYLINDRICAL |
认证状态 | Not Qualified |
技术 | MOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | WIRE |
端子位置 | BOTTOM |
Base Number Matches | 1 |
AM2804HM | AM1402A | AM1403A | AM1404A | AM1404AHM | AM2802DM | AM2803HM | AM2804HC | AM1403AHM | |
---|---|---|---|---|---|---|---|---|---|
描述 | Shift Register, 1024-Bit, MOS, MBCY8 | Shift Register, 256-Bit, MOS, CDIP16 | Shift Register, 512-Bit, MOS, MBCY8 | Shift Register, 1024-Bit, MOS, MBCY8 | Shift Register, 1024-Bit, MOS, MBCY8 | Shift Register, 256-Bit, MOS, CDIP16 | Shift Register, 512-Bit, MOS, MBCY8 | Shift Register, 1024-Bit, MOS, MBCY8 | Shift Register, 512-Bit, MOS, MBCY8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | , CAN8,.2 | DIP, DIP16,.3 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 | DIP, DIP16,.3 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | O-MBCY-W8 | R-XDIP-T16 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 | R-XDIP-T16 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
最大频率@ Nom-Sup | 5000000 Hz | 2500000 Hz | 2500000 Hz | 2500000 Hz | 2500000 Hz | 5000000 Hz | 5000000 Hz | 5000000 Hz | 2500000 Hz |
位数 | 1024 | 256 | 512 | 1024 | 1024 | 256 | 512 | 1024 | 512 |
功能数量 | 1 | 4 | 2 | 1 | 1 | 4 | 2 | 1 | 2 |
端子数量 | 8 | 16 | 8 | 8 | 8 | 16 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | - | - | - | -55 °C | -55 °C | -55 °C | - | -55 °C |
封装主体材料 | METAL | CERAMIC | METAL | METAL | METAL | CERAMIC | METAL | METAL | METAL |
封装等效代码 | CAN8,.2 | DIP16,.3 | CAN8,.2 | CAN8,.2 | CAN8,.2 | DIP16,.3 | CAN8,.2 | CAN8,.2 | CAN8,.2 |
封装形状 | ROUND | RECTANGULAR | ROUND | ROUND | ROUND | RECTANGULAR | ROUND | ROUND | ROUND |
封装形式 | CYLINDRICAL | IN-LINE | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | IN-LINE | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
技术 | MOS | MOS | MOS | MOS | MOS | MOS | MOS | MOS | MOS |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | WIRE | THROUGH-HOLE | WIRE | WIRE | WIRE | THROUGH-HOLE | WIRE | WIRE | WIRE |
端子位置 | BOTTOM | DUAL | BOTTOM | BOTTOM | BOTTOM | DUAL | BOTTOM | BOTTOM | BOTTOM |
厂商名称 | Msis Semiconductor Inc | - | - | - | - | Msis Semiconductor Inc | Msis Semiconductor Inc | Msis Semiconductor Inc | Msis Semiconductor Inc |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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