Shift Register, 256-Bit, MOS, CDIP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Msis Semiconductor Inc |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 最大频率@ Nom-Sup | 5000000 Hz |
| 位数 | 256 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | MOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| AM2802DM | AM1402A | AM1403A | AM1404A | AM1404AHM | AM2803HM | AM2804HC | AM2804HM | AM1403AHM | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Shift Register, 256-Bit, MOS, CDIP16 | Shift Register, 256-Bit, MOS, CDIP16 | Shift Register, 512-Bit, MOS, MBCY8 | Shift Register, 1024-Bit, MOS, MBCY8 | Shift Register, 1024-Bit, MOS, MBCY8 | Shift Register, 512-Bit, MOS, MBCY8 | Shift Register, 1024-Bit, MOS, MBCY8 | Shift Register, 1024-Bit, MOS, MBCY8 | Shift Register, 512-Bit, MOS, MBCY8 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 最大频率@ Nom-Sup | 5000000 Hz | 2500000 Hz | 2500000 Hz | 2500000 Hz | 2500000 Hz | 5000000 Hz | 5000000 Hz | 5000000 Hz | 2500000 Hz |
| 位数 | 256 | 256 | 512 | 1024 | 1024 | 512 | 1024 | 1024 | 512 |
| 功能数量 | 4 | 4 | 2 | 1 | 1 | 2 | 1 | 1 | 2 |
| 端子数量 | 16 | 16 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | - | - | -55 °C | -55 °C | - | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | METAL | METAL | METAL | METAL | METAL | METAL | METAL |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | CAN8,.2 | CAN8,.2 | CAN8,.2 | CAN8,.2 | CAN8,.2 | CAN8,.2 | CAN8,.2 |
| 封装形状 | RECTANGULAR | RECTANGULAR | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| 封装形式 | IN-LINE | IN-LINE | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 技术 | MOS | MOS | MOS | MOS | MOS | MOS | MOS | MOS | MOS |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE |
| 端子位置 | DUAL | DUAL | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 厂商名称 | Msis Semiconductor Inc | - | - | - | - | Msis Semiconductor Inc | Msis Semiconductor Inc | Msis Semiconductor Inc | Msis Semiconductor Inc |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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