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5962-9232101MZA

产品描述FIFO, 2KX9, 65ns, Asynchronous, CMOS, CQCC32, CERAMIC, LLCC-32
产品类别存储    存储   
文件大小401KB,共13页
制造商Cypress(赛普拉斯)
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5962-9232101MZA概述

FIFO, 2KX9, 65ns, Asynchronous, CMOS, CQCC32, CERAMIC, LLCC-32

5962-9232101MZA规格参数

参数名称属性值
厂商名称Cypress(赛普拉斯)
零件包装代码QFJ
包装说明QCCN,
针数32
Reach Compliance Codeunknown
ECCN代码EAR99
最长访问时间65 ns
其他特性BYPASS XCVR
周期时间80 ns
JESD-30 代码R-CQCC-N32
JESD-609代码e0
长度13.97 mm
内存密度18432 bit
内存宽度9
功能数量1
端子数量32
字数2048 words
字数代码2000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织2KX9
输出特性3-STATE
可输出NO
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QCCN
封装形状RECTANGULAR
封装形式CHIP CARRIER
并行/串行PARALLEL
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度2.286 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式NO LEAD
端子节距1.27 mm
端子位置QUAD
宽度11.43 mm
Base Number Matches1

5962-9232101MZA相似产品对比

5962-9232101MZA CY7C439-65JCR CY7C439-30JCR CY7C439-25JCR 5962-9232102MZA 5962-9232103MZA 5962-9232103MXA 5962-9232101MXA 5962-9232102MXA CY7C439-40JCR
描述 FIFO, 2KX9, 65ns, Asynchronous, CMOS, CQCC32, CERAMIC, LLCC-32 FIFO, 2KX9, 65ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 FIFO, 2KX9, 30ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 FIFO, 2KX9, 25ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 FIFO, 2KX9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LLCC-32 FIFO, 2KX9, 30ns, Asynchronous, CMOS, CQCC32, CERAMIC, LLCC-32 FIFO, 2KX9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28 FIFO, 2KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28 FIFO, 2KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28 FIFO, 2KX9, 40ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32
零件包装代码 QFJ QFJ QFJ QFJ QFJ QFJ DIP DIP DIP QFJ
包装说明 QCCN, QCCJ, QCCJ, QCCJ, QCCN, QCCN, DIP, DIP, DIP, QCCJ,
针数 32 32 32 32 32 32 28 28 28 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 65 ns 65 ns 30 ns 25 ns 40 ns 30 ns 30 ns 65 ns 40 ns 40 ns
其他特性 BYPASS XCVR BYPASS XCVR BYPASS XCVR BYPASS XCVR BYPASS XCVR BYPASS XCVR BYPASS XCVR BYPASS XCVR BYPASS XCVR BYPASS XCVR
周期时间 80 ns 80 ns 40 ns 35 ns 50 ns 40 ns 40 ns 80 ns 50 ns 50 ns
JESD-30 代码 R-CQCC-N32 R-PQCC-J32 R-PQCC-J32 R-PQCC-J32 R-CQCC-N32 R-CQCC-N32 R-GDIP-T28 R-GDIP-T28 R-GDIP-T28 R-PQCC-J32
长度 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 37.0205 mm 37.0205 mm 37.0205 mm 13.97 mm
内存密度 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit
内存宽度 9 9 9 9 9 9 9 9 9 9
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 32 32 32 32 32 32 28 28 28 32
字数 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
字数代码 2000 2000 2000 2000 2000 2000 2000 2000 2000 2000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 70 °C 70 °C 70 °C 125 °C 125 °C 125 °C 125 °C 125 °C 70 °C
最低工作温度 -55 °C - - - -55 °C -55 °C -55 °C -55 °C -55 °C -
组织 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
可输出 NO NO NO NO NO NO NO NO NO NO
封装主体材料 CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY
封装代码 QCCN QCCJ QCCJ QCCJ QCCN QCCN DIP DIP DIP QCCJ
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE IN-LINE CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.286 mm 3.55 mm 3.55 mm 3.55 mm 2.286 mm 2.286 mm 5.08 mm 5.08 mm 5.08 mm 3.55 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES NO NO NO YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY COMMERCIAL COMMERCIAL COMMERCIAL MILITARY MILITARY MILITARY MILITARY MILITARY COMMERCIAL
端子形式 NO LEAD J BEND J BEND J BEND NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD DUAL DUAL DUAL QUAD
宽度 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 7.62 mm 7.62 mm 7.62 mm 11.43 mm
厂商名称 Cypress(赛普拉斯) - Cypress(赛普拉斯) - Cypress(赛普拉斯) Cypress(赛普拉斯) - Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
JESD-609代码 e0 - - - e0 e0 e0 e0 e0 -
筛选级别 MIL-STD-883 - - - MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 -
端子面层 TIN LEAD - - - TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD -
Base Number Matches 1 1 1 1 1 1 1 - - -

 
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