2-CHANNEL, CROSS POINT SWITCH, QCC16, 4 X 4 MM, LLP-16
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| 模拟集成电路 - 其他类型 | CROSS POINT SWITCH |
| JESD-30 代码 | S-XQCC-N16 |
| JESD-609代码 | e3 |
| 长度 | 4 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 2 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 最长断开时间 | 12 ns |
| 最长接通时间 | 2000 ns |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 4 mm |
| Base Number Matches | 1 |
| DS25CP152TSQ | DS25CP152TSQ-NOPB | DS25CP152TSQX-NOPB | DS25CP152TSQ/NOPB | DS25CP152TSQX/NOPB | DS25CP152 | DS25CP152QSQ | |
|---|---|---|---|---|---|---|---|
| 描述 | 2-CHANNEL, CROSS POINT SWITCH, QCC16, 4 X 4 MM, LLP-16 | Analog & Digital Crosspoint ICs 3.125 Gbps LVDS 2x2 Crosspoint Switch 16-WQFN -40 to 85 | Analog & Digital Crosspoint ICs 3.125 Gbps LVDS 2x2 Crosspoint Switch 16-WQFN -40 to 85 | 3.125 Gbps LVDS 2x2 Crosspoint Switch 16-WQFN -40 to 85 | Analog & Digital Crosspoint ICs 3.125 Gbps LVDS 2x2 Crosspoint Switch 16-WQFN -40 to 85 | DS25CP152 3.125 Gbps LVDS 2x2 Crosspoint Switch | 4-CHANNEL, CROSS POINT SWITCH, QCC16, 4 X 4 MM, LLP-16 |
| 是否无铅 | 不含铅 | - | - | 不含铅 | 含铅 | - | 含铅 |
| 是否Rohs认证 | 符合 | - | - | 符合 | 符合 | - | 不符合 |
| 包装说明 | HVQCCN, | - | - | HVQCCN, LCC16,.16SQ,20 | QCCN, LCC16,.16SQ,20 | - | HVQCCN, |
| Reach Compliance Code | compliant | - | - | compliant | compliant | - | compliant |
| 模拟集成电路 - 其他类型 | CROSS POINT SWITCH | - | - | CROSS POINT SWITCH | CROSS POINT SWITCH | - | CROSS POINT SWITCH |
| JESD-30 代码 | S-XQCC-N16 | - | - | S-PQCC-N16 | S-PQCC-N16 | - | S-XQCC-N16 |
| JESD-609代码 | e3 | - | - | e3 | e3 | - | e0 |
| 湿度敏感等级 | 1 | - | - | 1 | 1 | - | 1 |
| 功能数量 | 1 | - | - | 1 | 1 | - | 1 |
| 端子数量 | 16 | - | - | 16 | 16 | - | 16 |
| 最高工作温度 | 85 °C | - | - | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | UNSPECIFIED |
| 封装代码 | HVQCCN | - | - | HVQCCN | QCCN | - | HVQCCN |
| 封装形状 | SQUARE | - | - | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | - | - | 260 | 260 | - | 260 |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | - | Not Qualified |
| 标称供电电压 (Vsup) | 3.3 V | - | - | 3.3 V | 3.3 V | - | 3.3 V |
| 表面贴装 | YES | - | - | YES | YES | - | YES |
| 最长接通时间 | 2000 ns | - | - | 20000 ns | 20000 ns | - | 20000 ns |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | TIN | - | - | Matte Tin (Sn) | Matte Tin (Sn) | - | TIN LEAD |
| 端子形式 | NO LEAD | - | - | NO LEAD | NO LEAD | - | NO LEAD |
| 端子节距 | 0.5 mm | - | - | 0.5 mm | 0.5 mm | - | 0.5 mm |
| 端子位置 | QUAD | - | - | QUAD | QUAD | - | QUAD |
| 处于峰值回流温度下的最长时间 | 40 | - | - | NOT SPECIFIED | NOT SPECIFIED | - | 40 |
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