Datasheet> 器件分类 > 模拟混合信号IC> 驱动程序和接口> SKIIP1813GB121-3DUW

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SKIIP1813GB121-3DUW: 产品描述Half Bridge Based Peripheral Driver, 3000A; 产品类别模拟混合信号IC 驱动程序和接口; 文件大小158KB，共1页; 制造商SEMIKRON; 官网地址http://www.semikron.com; 标准

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SKIIP1813GB121-3DUW概述

Half Bridge Based Peripheral Driver, 3000A

SKIIP1813GB121-3DUW规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
包装说明	,
Reach Compliance Code	compliant
ECCN代码	EAR99
内置保护	TRANSIENT
接口集成电路类型	HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码	R-XXMA-X
JESD-609代码	e3/e4
功能数量	3
输出电流流向	SOURCE AND SINK
标称输出峰值电流	3000 A
封装主体材料	UNSPECIFIED
封装形状	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY
峰值回流温度（摄氏度）	NOT SPECIFIED
认证状态	Not Qualified
表面贴装	NO
端子面层	TIN/SILVER
端子形式	UNSPECIFIED
端子位置	UNSPECIFIED
处于峰值回流温度下的最长时间	NOT SPECIFIED
Base Number Matches	1

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SKiiP 1813GB121-3DL

I. Power section 3 * SKiiP613GB121CT per phase

Absolute maximum ratings

Symbol

Conditions

Values

1200

900

1800 / 1350

3600

1350 / 1012,5

2700

12960

840

-40...+150 (125)

3000

3 * 500

Units

°C

IGBT and inverse diode

CES

Operating DC link voltage

GES

IGBT, T

heat sink

= 25 / 70 °C

IGBT, t

< 1 ms,T

heat sink

= 25°C

Diode, T

heat sink

= 25 / 70 °C

Diode, t

< 1 ms

FSM

Diode, T

= 150 °C, 10ms; sin

I t (Diode) Diode, T

= 150 °C, 10ms

, (T

stg

)

isol

AC, 1min.

C-package

heat sink

= 70°C, T

term

= 115 °C

SKiiPPACK



SK integrated intelligent

Power PACK

3 Generation

2-pack

SKiiP 1813GB121-3DL

Target data

housing S33

Characteristics

Symbol

IGBT

(BR)CES

Conditions

min.

≥V

CES

−

typ.

−

3,6

108

0,9

0,90

2,3

−

515

837

0,13

1,8

−

1,0

0,61

−

3 * 400

3 * 500

0,1

3000

max.

−

Units

mΩ

°C/W

gate driver without supply

= 0,

= 25 °C

CES

= 125 °C

= V

CES

CEO

= 125 °C

CEsat

= 1470A,

= 125 °C

CEsat

= 1470A,

= 25 °C

I =1470A,

=600V

+ E

off5) C

=900V

= 125 °C

per SKiiP, AC side

top, bottom

CC´-EE´

resistance, terminal-chip

Inverse diode

= V

= 1350A;

= 125 °C

= V

= 1350A;

= 25 °C

+ E

off

= 1350A;

= 125 °C

Thermal characteristics

thjs

per IGBT

thjs

per diode

thsa

L: P16 heat sink; 280 m

/ h

W: WK 40; 8l/min; 50% glycol

Current sensor

p RMS

=100° C , V

supply

15V

pmax RMS

≤

supply

≥ ±14,25V,

0≤I≤

700A,

Linearity

per sensor

ppeak

≤

10 µs, per sensor

Mechanical data

DC terminals, SI Units

AC terminals, SI Units

to heat sink

−

2,5

−

0,024

0,042

0,033

0,010

Features

•

SKiiP technology inside

pressure contact of ceramic

to heat sink; low thermal

impedance

pressure contact of main

electric terminals

pressure contact of auxiliary

electric terminals

increased thermal cycling

capability

low stray inductance

homogenous current

distribution

•

integrated current sensor

•

integrated temperature sensor

•

high power density

−

heatsink

= 25 °C, unless

otherwise specified

CAL = Controlled Axial Lifetime

Technology (soft and fast)

D integrated gate driver

U with DC-bus voltage

measurement (option for GB)

L mounted on standard P16 for

forced air cooling

W mounted on standard water

cooler

term

= temperature of terminal

with SKiiPPACK 3

generation

gate driver

assembly instruction must be

followed

measured at chip level

external paralleling necessary

This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee,

expressed or implied is made regarding delivery, performance or suitability.

B 7

−

000911

by

SEMIKRON

SKIIP1813GB121-3DUW相似产品对比

	SKIIP1813GB121-3DUW	SKIIP1813GB121-3DLW	SKIIP1813GB121-3DL	SKIIP1813GB121-3DULW	SKIIP1813GB121-3DUL	SKIIP1813GB121-3DU	SKIIP1813GB121-3DW
描述	Half Bridge Based Peripheral Driver, 3000A	Half Bridge Based Peripheral Driver, 3000A	Half Bridge Based Peripheral Driver, 3000A	Half Bridge Based Peripheral Driver, 3000A	Half Bridge Based Peripheral Driver, 3000A	Half Bridge Based Peripheral Driver, 3000A	Half Bridge Based Peripheral Driver, 3000A
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
内置保护	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT
接口集成电路类型	HALF BRIDGE BASED PERIPHERAL DRIVER	HALF BRIDGE BASED PERIPHERAL DRIVER	HALF BRIDGE BASED PERIPHERAL DRIVER	HALF BRIDGE BASED PERIPHERAL DRIVER	HALF BRIDGE BASED PERIPHERAL DRIVER	HALF BRIDGE BASED PERIPHERAL DRIVER	HALF BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码	R-XXMA-X	R-XXMA-X	R-XXMA-X	R-XXMA-X	R-XXMA-X	R-XXMA-X	R-XXMA-X
JESD-609代码	e3/e4	e3/e4	e2	e3/e4	e3/e4	e3/e4	e3/e4
功能数量	3	3	3	3	3	3	3
输出电流流向	SOURCE AND SINK	SOURCE AND SINK	SOURCE AND SINK	SOURCE AND SINK	SOURCE AND SINK	SOURCE AND SINK	SOURCE AND SINK
标称输出峰值电流	3000 A	3000 A	3000 A	3000 A	3000 A	3000 A	3000 A
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	NO	NO	NO	NO	NO	NO	NO
端子面层	TIN/SILVER	TIN/SILVER	Tin/Silver (Sn/Ag)	TIN/SILVER	TIN/SILVER	TIN/SILVER	TIN/SILVER
端子形式	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
端子位置	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	1	1	1	1	1	1	1

SKIIP1813GB121-3DUW

SKIIP1813GB121-3DUW概述

SKIIP1813GB121-3DUW规格参数

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