5962-9466903QXX概述

32-BIT, 50MHz, OTHER DSP, CPGA325, CERAMIC, PGA-325

5962-9466903QXX规格参数

参数名称	属性值
厂商名称	Texas Instruments(德州仪器)
零件包装代码	PGA
包装说明	PGA,
针数	325
Reach Compliance Code	compliant
ECCN代码	3A001.A.2.C
地址总线宽度	31
桶式移位器	YES
边界扫描	YES
最大时钟频率	50 MHz
外部数据总线宽度	32
格式	FLOATING POINT
集成缓存	YES
内部总线架构	MULTIPLE
JESD-30 代码	S-CPGA-P325
低功率模式	YES
DMA 通道数量	6
端子数量	325
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	PGA
封装形状	SQUARE
封装形式	GRID ARRAY
峰值回流温度（摄氏度）	NOT SPECIFIED
认证状态	Qualified
筛选级别	MIL-PRF-38535 Class Q
最大压摆率	850 mA
最大供电电压	5.25 V
最小供电电压	4.75 V
标称供电电压	5 V
表面贴装	NO
技术	CMOS
温度等级	MILITARY
端子形式	PIN/PEG
端子位置	PERPENDICULAR
处于峰值回流温度下的最长时间	NOT SPECIFIED
uPs/uCs/外围集成电路类型	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

5962-9466903QXX相似产品对比

	5962-9466903QXX	5962-9466903QZX	5962-9466902QZC	5962-9466902QZX	5962-9466901QYC	5962-9466901QXA	5962-9466903QZC	5962-9466903QYX	5962-9466903QUX	5962-9466902QUX
描述	32-BIT, 50MHz, OTHER DSP, CPGA325, CERAMIC, PGA-325	32-BIT, 50MHz, OTHER DSP, UUC325, DIE-325	32-BIT, 40MHz, OTHER DSP, UUC325, DIE-325	32-BIT, 40MHz, OTHER DSP, UUC325, DIE-325	32-BIT, 33.33MHz, OTHER DSP, CQFP352	32-BIT, 33.33MHz, OTHER DSP, CPGA325	32-BIT, 50MHz, OTHER DSP, UUC325, DIE-325	32-BIT, 50MHz, OTHER DSP, CQFP352, CERAMIC, QFP-352	32-BIT, 50MHz, OTHER DSP, UUC324, ENVIRONMENTALLY PROTECTED TAPE AUTOMATED BOND-325	32-BIT, 40MHz, OTHER DSP, UUC324, ENVIRONMENTALLY PROTECTED TAPE AUTOMATED BOND-325
包装说明	PGA,	DIE,	DIE,	DIE,	QFF, TPAK352,3.0SQ	PGA, SPGA325,35X35MOD	DIE,	QFF,	DIE,	DIE,
Reach Compliance Code	compliant	unknown	unknown	unknown	unknown	not_compliant	unknown	compliant	unknown	unknown
ECCN代码	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
地址总线宽度	31	31	31	31	31	31	31	31	31	31
桶式移位器	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
边界扫描	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	50 MHz	50 MHz	40 MHz	40 MHz	33.33 MHz	33.33 MHz	50 MHz	50 MHz	50 MHz	40 MHz
外部数据总线宽度	32	32	32	32	32	32	32	32	32	32
格式	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
内部总线架构	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 代码	S-CPGA-P325	S-XUUC-N325	S-XUUC-N325	S-XUUC-N325	S-CQFP-F352	S-CPGA-P325	S-XUUC-N325	R-CQFP-F352	S-XUUC-N324	S-XUUC-N324
低功率模式	YES	YES	YES	YES	NO	NO	YES	YES	YES	YES
端子数量	325	325	325	325	352	325	325	352	324	324
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED
封装代码	PGA	DIE	DIE	DIE	QFF	PGA	DIE	QFF	DIE	DIE
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE
封装形式	GRID ARRAY	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	FLATPACK	GRID ARRAY	UNCASED CHIP	FLATPACK	UNCASED CHIP	UNCASED CHIP
认证状态	Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Qualified	Not Qualified	Not Qualified
最大供电电压	5.25 V	5.25 V	5.25 V	5.25 V	5.5 V	5.5 V	5.25 V	5.25 V	5.25 V	5.25 V
最小供电电压	4.75 V	4.75 V	4.75 V	4.75 V	4.5 V	4.5 V	4.75 V	4.75 V	4.75 V	4.75 V
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	YES	YES	YES	NO	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	PIN/PEG	NO LEAD	NO LEAD	NO LEAD	FLAT	PIN/PEG	NO LEAD	FLAT	NO LEAD	NO LEAD
端子位置	PERPENDICULAR	UPPER	UPPER	UPPER	QUAD	PERPENDICULAR	UPPER	QUAD	UPPER	UPPER
uPs/uCs/外围集成电路类型	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1	1	1	1	1	1	1	1	1	1
零件包装代码	PGA	DIE	DIE	DIE	-	-	DIE	QFP	DIE	DIE
针数	325	325	325	325	-	-	325	352	324	324
筛选级别	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q	-	-

5962-9466903QXX

5962-9466903QXX概述

5962-9466903QXX规格参数

5962-9466903QXX相似产品对比

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