32-BIT, 33.33MHz, OTHER DSP, CQFP352
| 参数名称 | 属性值 |
| 包装说明 | QFF, TPAK352,3.0SQ |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 地址总线宽度 | 31 |
| 桶式移位器 | YES |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 33.33 MHz |
| 外部数据总线宽度 | 32 |
| 格式 | FLOATING POINT |
| 集成缓存 | NO |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-CQFP-F352 |
| JESD-609代码 | e4 |
| 低功率模式 | NO |
| DMA 通道数量 | 6 |
| 外部中断装置数量 | 5 |
| 串行 I/O 数 | |
| 端子数量 | 352 |
| 计时器数量 | 2 |
| 片上数据RAM宽度 | 32 |
| 片上程序ROM宽度 | |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFF |
| 封装等效代码 | TPAK352,3.0SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM(字数) | 1024 |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 最大压摆率 | 850 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| 5962-9466901QYC | 5962-9466903QZX | 5962-9466902QZC | 5962-9466902QZX | 5962-9466901QXA | 5962-9466903QZC | 5962-9466903QYX | 5962-9466903QUX | 5962-9466902QUX | 5962-9466903QXX | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 32-BIT, 33.33MHz, OTHER DSP, CQFP352 | 32-BIT, 50MHz, OTHER DSP, UUC325, DIE-325 | 32-BIT, 40MHz, OTHER DSP, UUC325, DIE-325 | 32-BIT, 40MHz, OTHER DSP, UUC325, DIE-325 | 32-BIT, 33.33MHz, OTHER DSP, CPGA325 | 32-BIT, 50MHz, OTHER DSP, UUC325, DIE-325 | 32-BIT, 50MHz, OTHER DSP, CQFP352, CERAMIC, QFP-352 | 32-BIT, 50MHz, OTHER DSP, UUC324, ENVIRONMENTALLY PROTECTED TAPE AUTOMATED BOND-325 | 32-BIT, 40MHz, OTHER DSP, UUC324, ENVIRONMENTALLY PROTECTED TAPE AUTOMATED BOND-325 | 32-BIT, 50MHz, OTHER DSP, CPGA325, CERAMIC, PGA-325 |
| 包装说明 | QFF, TPAK352,3.0SQ | DIE, | DIE, | DIE, | PGA, SPGA325,35X35MOD | DIE, | QFF, | DIE, | DIE, | PGA, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | not_compliant | unknown | compliant | unknown | unknown | compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 地址总线宽度 | 31 | 31 | 31 | 31 | 31 | 31 | 31 | 31 | 31 | 31 |
| 桶式移位器 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 33.33 MHz | 50 MHz | 40 MHz | 40 MHz | 33.33 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz | 50 MHz |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-CQFP-F352 | S-XUUC-N325 | S-XUUC-N325 | S-XUUC-N325 | S-CPGA-P325 | S-XUUC-N325 | R-CQFP-F352 | S-XUUC-N324 | S-XUUC-N324 | S-CPGA-P325 |
| 低功率模式 | NO | YES | YES | YES | NO | YES | YES | YES | YES | YES |
| 端子数量 | 352 | 325 | 325 | 325 | 325 | 325 | 352 | 324 | 324 | 325 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QFF | DIE | DIE | DIE | PGA | DIE | QFF | DIE | DIE | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | GRID ARRAY | UNCASED CHIP | FLATPACK | UNCASED CHIP | UNCASED CHIP | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Qualified | Not Qualified | Not Qualified | Qualified |
| 最大供电电压 | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | NO LEAD | NO LEAD | NO LEAD | PIN/PEG | NO LEAD | FLAT | NO LEAD | NO LEAD | PIN/PEG |
| 端子位置 | QUAD | UPPER | UPPER | UPPER | PERPENDICULAR | UPPER | QUAD | UPPER | UPPER | PERPENDICULAR |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 筛选级别 | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | - | - | MIL-PRF-38535 Class Q |
| 零件包装代码 | - | DIE | DIE | DIE | - | DIE | QFP | DIE | DIE | PGA |
| 针数 | - | 325 | 325 | 325 | - | 325 | 352 | 324 | 324 | 325 |
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