Multiplexer, 2-Func, 4 Line Input, TTL, CDFP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DFP, FL16,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDFP-F16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | MULTIPLEXER |
功能数量 | 2 |
输入次数 | 4 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
电源 | 5 V |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class B (Modified) |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
S54S253W/883B | 54S253/B2A | 54S253/BEA | S54S253F/883B | N74S253D | N74S253N | |
---|---|---|---|---|---|---|
描述 | Multiplexer, 2-Func, 4 Line Input, TTL, CDFP16 | Multiplexer, 2-Func, 4 Line Input, TTL, CQCC20 | Multiplexer, 2-Func, 4 Line Input, TTL, CDIP16 | Multiplexer, 2-Func, 4 Line Input, TTL, CDIP16 | Multiplexer, 2-Func, 4 Line Input, TTL, PDSO16 | Multiplexer, 2-Func, 4 Line Input, TTL, PDIP16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDFP-F16 | S-XQCC-N20 | R-XDIP-T16 | R-XDIP-T16 | R-PDSO-G16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
输入次数 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 16 | 20 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DFP | QCCN | DIP | DIP | SOP | DIP |
封装等效代码 | FL16,.3 | LCC20,.35SQ | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
筛选级别 | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) | - | - |
最大I(ol) | - | 0.02 A | 0.02 A | - | 0.02 A | 0.02 A |
最大电源电流(ICC) | - | 100 mA | 100 mA | - | 70 mA | 70 mA |
Prop。Delay @ Nom-Sup | - | 18 ns | 18 ns | - | 18 ns | 18 ns |
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