QDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
参数名称 | 属性值 |
厂商名称 | GSI Technology |
包装说明 | LBGA, |
Reach Compliance Code | compliant |
ECCN代码 | 3A991.B.2.B |
最长访问时间 | 0.45 ns |
JESD-30 代码 | R-PBGA-B165 |
长度 | 15 mm |
内存密度 | 67108864 bit |
内存集成电路类型 | QDR SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 165 |
字数 | 8388608 words |
字数代码 | 8000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 8MX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LBGA |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE |
并行/串行 | PARALLEL |
座面最大高度 | 1.4 mm |
最大供电电压 (Vsup) | 1.9 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
宽度 | 13 mm |
Base Number Matches | 1 |
GS8662D06BD-450MT | GS8662D06BD-450M | GS8662D20BD-450M | GS8662D20BD-450MT | GS8662D38BD-450M | GS8662D38BD-450MT | |
---|---|---|---|---|---|---|
描述 | QDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | QDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 |
包装说明 | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
最长访问时间 | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns | 0.45 ns |
JESD-30 代码 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 |
长度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
内存密度 | 67108864 bit | 67108864 bit | 75497472 bit | 75497472 bit | 75497472 bit | 75497472 bit |
内存集成电路类型 | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM |
内存宽度 | 8 | 8 | 18 | 18 | 36 | 36 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 165 | 165 | 165 | 165 | 165 | 165 |
字数 | 8388608 words | 8388608 words | 4194304 words | 4194304 words | 2097152 words | 2097152 words |
字数代码 | 8000000 | 8000000 | 4000000 | 4000000 | 2000000 | 2000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 8MX8 | 8MX8 | 4MX18 | 4MX18 | 2MX36 | 2MX36 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm |
厂商名称 | GSI Technology | GSI Technology | - | - | GSI Technology | GSI Technology |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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