Synchronous DRAM, 16MX32, 7ns, CMOS, PBGA90
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
Reach Compliance Code | compliant |
最长访问时间 | 7 ns |
最大时钟频率 (fCLK) | 111 MHz |
I/O 类型 | COMMON |
交错的突发长度 | 1,2,4,8 |
JESD-30 代码 | R-PBGA-B90 |
内存密度 | 536870912 bit |
内存集成电路类型 | SYNCHRONOUS DRAM |
内存宽度 | 32 |
端子数量 | 90 |
字数 | 16777216 words |
字数代码 | 16000000 |
最高工作温度 | 70 °C |
最低工作温度 | -25 °C |
组织 | 16MX32 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FBGA |
封装等效代码 | BGA90,9X15,32 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, FINE PITCH |
电源 | 2.5 V |
认证状态 | Not Qualified |
刷新周期 | 8192 |
连续突发长度 | 1,2,4,8,FP |
最大待机电流 | 0.001 A |
最大压摆率 | 0.28 mA |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
Base Number Matches | 1 |
K4S51323LF-EL1H | K4S51323LF-EC75 | K4S51323LF-EF1H | K4S51323LF-EF1L | K4S51323LF-EF75 | K4S51323LF-EC1L | K4S51323LF-MF75 | K4S51323LF-MC75 | |
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描述 | Synchronous DRAM, 16MX32, 7ns, CMOS, PBGA90 | Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90 | Synchronous DRAM, 16MX32, 7ns, CMOS, PBGA90 | Synchronous DRAM, 16MX32, 7ns, CMOS, PBGA90 | Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90 | Synchronous DRAM, 16MX32, 7ns, CMOS, PBGA90 | Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90 | Synchronous DRAM, 16MX32, 5.4ns, CMOS, PBGA90 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
最长访问时间 | 7 ns | 5.4 ns | 7 ns | 7 ns | 5.4 ns | 7 ns | 5.4 ns | 5.4 ns |
最大时钟频率 (fCLK) | 111 MHz | 133 MHz | 111 MHz | 111 MHz | 133 MHz | 111 MHz | 133 MHz | 133 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
交错的突发长度 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 |
JESD-30 代码 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 |
内存密度 | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit |
内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 |
字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
组织 | 16MX32 | 16MX32 | 16MX32 | 16MX32 | 16MX32 | 16MX32 | 16MX32 | 16MX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA |
封装等效代码 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 | BGA90,9X15,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
电源 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
连续突发长度 | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP |
最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
最大压摆率 | 0.28 mA | 0.3 mA | 0.28 mA | 0.24 mA | 0.3 mA | 0.24 mA | 0.3 mA | 0.3 mA |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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