SnapTac Series
Miniature Rectangular
Connectors
• HyperSpring
®
spring loaded contacts, self-cleaning
wiping action
• 12 or 21 contact configurations
• Combine robust environmental performance
with compact size and light weight
• Easy and fast push-pull locking mechanism
• Full line EMI shielding
• IP67 sealing when mated and unmated
• D-shape hardware coding to avoid mismatching
• 4 position key coding available on request
• Overmolding solutions
• Upgrade commercial high speed Fast Ethernet, USB,
IEEE 1394 interconnect to Mil Spec performances
General Specifications
General
Number of Contacts
Receptacle Terminations
Plug Termination
Cable Diameter Range
AWG Contact
HyperSpring Force
Connector Mating Force
Connector Unmating Force
12, 21
Solder Cup, Dip Solder
Solder Cup
0.315 [8.00] max.
26 - 30
5.5 oz. max. per contact
12 Contacts: 180.0 oz., 21 Contacts: 215.0 oz.
36.0 oz. (after locking system release)
Electrical and Mechanical Characteristics
EMI Shielding
Current Rating
Breakdown Voltage
Dielectric Withstanding Voltage
(between contacts)
Contact Resistance
(low level)
Insulation Resistance
Vibration
Shock
Weight
(Plug and Receptacle – with contacts – without cabling)
Yes
3 Amps at 25° C
625V
500V
< 15 milliohms
5000 Megohms at 500VDC - EIA364.21
EIA364.28 Condition III
EIA364.27 Condition G
12 Contacts: 0.8 oz., 21 Contacts: 1.0 oz.
Materials and Plating
Housing
Material
Plating
Plug Overmolding
Contact
Material
Plating
Aluminium alloy
Zinc cobalt conductive – RoHS compliant
Thermoplastic hotmelt
Brass, beryllium copper
Gold
Environmental Characteristics
Temperature Range
Salt Spray
Humidity
IP Level
-65° C to 80° C
EIA364.26 Condition A (mated connectors)
EIA364.31 Method IV
67 mated and unmated
Dimensions are in inches [mm]
www.hypertronics.com
3 / 111
51单片机
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
