HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDIP14
HC/UH系列, 四 2输入 或非门, PDIP14
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | MO-001 |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDIP-T14 |
| 长度 | 19.025 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | NOR GATE |
| 最大I(ol) | 0.004 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | BULK PACK |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Su | 27 ns |
| 传播延迟(tpd) | 27 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 4.2 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |

| 74HC02N | 74HC02 | 74HCT02N | 74HCT02 | 74HCT02PW | 74HCT02BQ | 74HC02PW | 74HC02DB | 74HC02BQ | 74HC02D | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDIP14 | Quad 2-input NOR gate | Quad 2-input NOR gate | Quad 2-input NOR gate | Quad 2-input NOR gate | Quad 2-input NOR gate | Quad 2-input NOR gate | HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDSO14 | Quad 2-input NOR gate | HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDSO14 |
| 是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | MO-001 | - | MO-001 | - | TSSOP | QFN | TSSOP | SSOP | QFN | SOIC |
| 包装说明 | DIP, DIP14,.3 | - | DIP, DIP14,.3 | - | 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 | HVSON, LCC14,.1X.12,20 | 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 | 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 | 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, VQFN-14 | 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 |
| 针数 | 14 | - | 14 | - | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknow | - | unknow | - | unknow | compli | unknow | unknow | compli | unknow |
| 系列 | HC/UH | - | HCT | - | HCT | HCT | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-PDIP-T14 | - | R-PDIP-T14 | - | R-PDSO-G14 | R-PDSO-N14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-N14 | R-PDSO-G14 |
| 长度 | 19.025 mm | - | 19.025 mm | - | 5 mm | 3 mm | 5 mm | 6.2 mm | 3 mm | 8.65 mm |
| 负载电容(CL) | 50 pF | - | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | NOR GATE | - | NOR GATE | - | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE |
| 最大I(ol) | 0.004 A | - | 0.004 A | - | 0.004 A | 0.00002 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 功能数量 | 4 | - | 4 | - | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | - | 2 | - | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | - | 14 | - | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | - | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | - | TSSOP | HVSON | TSSOP | SSOP | HVSON | SOP |
| 封装等效代码 | DIP14,.3 | - | DIP14,.3 | - | TSSOP14,.25 | LCC14,.1X.12,20 | TSSOP14,.25 | SSOP14,.3 | LCC14,.1X.12,20 | SOP14,.25 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE |
| 包装方法 | BULK PACK | - | BULK PACK | - | TUBE | TAPE AND REEL | TUBE | TUBE | TAPE AND REEL | BULK |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | - | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2/6 V | - | 5 V | - | 5 V | 5 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Su | 27 ns | - | 29 ns | - | 29 ns | 29 ns | 27 ns | 27 ns | 27 ns | 27 ns |
| 传播延迟(tpd) | 27 ns | - | 29 ns | - | 29 ns | 29 ns | 27 ns | 27 ns | 27 ns | 27 ns |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | - | NO | - | NO | NO | NO | NO | NO | NO |
| 座面最大高度 | 4.2 mm | - | 4.2 mm | - | 1.1 mm | 1 mm | 1.1 mm | 2 mm | 1 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | - | 5.5 V | - | 5.5 V | 5.5 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | - | 4.5 V | - | 4.5 V | 4.5 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | NO | - | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | - | GULL WING | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 2.54 mm | - | 2.54 mm | - | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | 30 | - | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 7.62 mm | - | 7.62 mm | - | 4.4 mm | 2.5 mm | 4.4 mm | 5.3 mm | 2.5 mm | 3.9 mm |
| Base Number Matches | 1 | - | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | - | - | e4 | - | e4 | e4 | e4 | e4 | e4 | e4 |
| 湿度敏感等级 | - | - | - | - | 1 | 1 | 1 | 1 | 1 | 1 |
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