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74HCT02BQ

产品描述Quad 2-input NOR gate
产品类别逻辑    逻辑   
文件大小86KB,共15页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74HCT02BQ概述

Quad 2-input NOR gate

74HCT02BQ规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码QFN
包装说明HVSON, LCC14,.1X.12,20
针数14
Reach Compliance Codecompli
系列HCT
JESD-30 代码R-PDSO-N14
JESD-609代码e4
长度3 mm
负载电容(CL)50 pF
逻辑集成电路类型NOR GATE
最大I(ol)0.00002 A
湿度敏感等级1
功能数量4
输入次数2
端子数量14
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码HVSON
封装等效代码LCC14,.1X.12,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源5 V
Prop。Delay @ Nom-Su29 ns
传播延迟(tpd)29 ns
认证状态Not Qualified
施密特触发器NO
座面最大高度1 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度2.5 mm
Base Number Matches1

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74HC02; 74HCT02
Quad 2-input NOR gate
Rev. 03 — 18 September 2008
Product data sheet
1. General description
The 74HC02; 74HCT02 are high-speed Si-gate CMOS devices that comply with JEDEC
standard no. 7A. They are pin compatible with Low-power Schottky TTL (LSTTL).
The 74HC02; 74HCT02 provides a quad 2-input NOR function.
2. Features
I
Input levels:
N
For 74HC02: CMOS level
N
For 74HCT02: TTL level
I
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74HC02N
74HCT02N
74HC02D
74HCT02D
74HC02DB
74HCT02DB
74HC02PW
74HCT02PW
74HC02BQ
74HCT02BQ
−40 °C
to +125
°C
DHVQFN14
−40 °C
to +125
°C
TSSOP14
−40 °C
to +125
°C
SSOP14
−40 °C
to +125
°C
SO14
plastic small outline package; 14 leads; body width
3.9 mm
plastic shrink small outline package; 14 leads; body
width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT108-1
SOT337-1
SOT402-1
−40 °C
to +125
°C
Name
DIP14
Description
plastic dual in-line package; 14 leads (300 mil)
Version
SOT27-1
Type number
plastic dual in-line compatible thermal enhanced very SOT762-1
thin quad flat package; no leads; 14 terminals;
body 2.5
×
3
×
0.85 mm

74HCT02BQ相似产品对比

74HCT02BQ 74HC02 74HCT02N 74HC02N 74HCT02 74HCT02PW 74HC02PW 74HC02DB 74HC02BQ 74HC02D
描述 Quad 2-input NOR gate Quad 2-input NOR gate Quad 2-input NOR gate HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDIP14 Quad 2-input NOR gate Quad 2-input NOR gate Quad 2-input NOR gate HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDSO14 Quad 2-input NOR gate HC/UH SERIES, QUAD 2-INPUT NOR GATE, PDSO14
是否无铅 不含铅 - 不含铅 不含铅 - 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 - 符合 符合 - 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 QFN - MO-001 MO-001 - TSSOP TSSOP SSOP QFN SOIC
包装说明 HVSON, LCC14,.1X.12,20 - DIP, DIP14,.3 DIP, DIP14,.3 - 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, VQFN-14 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
针数 14 - 14 14 - 14 14 14 14 14
Reach Compliance Code compli - unknow unknow - unknow unknow unknow compli unknow
系列 HCT - HCT HC/UH - HCT HC/UH HC/UH HC/UH HC/UH
JESD-30 代码 R-PDSO-N14 - R-PDIP-T14 R-PDIP-T14 - R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-N14 R-PDSO-G14
JESD-609代码 e4 - e4 - - e4 e4 e4 e4 e4
长度 3 mm - 19.025 mm 19.025 mm - 5 mm 5 mm 6.2 mm 3 mm 8.65 mm
负载电容(CL) 50 pF - 50 pF 50 pF - 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 NOR GATE - NOR GATE NOR GATE - NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE
最大I(ol) 0.00002 A - 0.004 A 0.004 A - 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
湿度敏感等级 1 - - - - 1 1 1 1 1
功能数量 4 - 4 4 - 4 4 4 4 4
输入次数 2 - 2 2 - 2 2 2 2 2
端子数量 14 - 14 14 - 14 14 14 14 14
最高工作温度 125 °C - 125 °C 125 °C - 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C - -40 °C -40 °C - -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HVSON - DIP DIP - TSSOP TSSOP SSOP HVSON SOP
封装等效代码 LCC14,.1X.12,20 - DIP14,.3 DIP14,.3 - TSSOP14,.25 TSSOP14,.25 SSOP14,.3 LCC14,.1X.12,20 SOP14,.25
封装形状 RECTANGULAR - RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - IN-LINE IN-LINE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
包装方法 TAPE AND REEL - BULK PACK BULK PACK - TUBE TUBE TUBE TAPE AND REEL BULK
峰值回流温度(摄氏度) 260 - 260 NOT SPECIFIED - 260 260 260 260 260
电源 5 V - 5 V 2/6 V - 5 V 2/6 V 2/6 V 2/6 V 2/6 V
Prop。Delay @ Nom-Su 29 ns - 29 ns 27 ns - 29 ns 27 ns 27 ns 27 ns 27 ns
传播延迟(tpd) 29 ns - 29 ns 27 ns - 29 ns 27 ns 27 ns 27 ns 27 ns
认证状态 Not Qualified - Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
施密特触发器 NO - NO NO - NO NO NO NO NO
座面最大高度 1 mm - 4.2 mm 4.2 mm - 1.1 mm 1.1 mm 2 mm 1 mm 1.75 mm
最大供电电压 (Vsup) 5.5 V - 5.5 V 6 V - 5.5 V 6 V 6 V 6 V 6 V
最小供电电压 (Vsup) 4.5 V - 4.5 V 2 V - 4.5 V 2 V 2 V 2 V 2 V
标称供电电压 (Vsup) 5 V - 5 V 5 V - 5 V 5 V 5 V 5 V 5 V
表面贴装 YES - NO NO - YES YES YES YES YES
技术 CMOS - CMOS CMOS - CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL/PALLADIUM/GOLD (NI/PD/AU) - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
端子形式 NO LEAD - THROUGH-HOLE THROUGH-HOLE - GULL WING GULL WING GULL WING NO LEAD GULL WING
端子节距 0.5 mm - 2.54 mm 2.54 mm - 0.65 mm 0.65 mm 0.65 mm 0.5 mm 1.27 mm
端子位置 DUAL - DUAL DUAL - DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 - 30 NOT SPECIFIED - 30 30 30 30 30
宽度 2.5 mm - 7.62 mm 7.62 mm - 4.4 mm 4.4 mm 5.3 mm 2.5 mm 3.9 mm
Base Number Matches 1 - 1 1 - 1 1 1 1 1

 
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