Line Driver/Receiver, 1 Driver, Hybrid, MDIP24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP24,1.1 |
| Reach Compliance Code | compliant |
| 差分输出 | YES |
| 驱动器位数 | 1 |
| 高电平输入电流最大值 | 0.00004 A |
| JESD-30 代码 | R-MDIP-T24 |
| JESD-609代码 | e0 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最小输出摆幅 | 26 V |
| 最大输出低电流 | 0.004 A |
| 封装主体材料 | METAL |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,1.1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5,+-12/+-15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 表面贴装 | NO |
| 技术 | HYBRID |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| BUS-63102-883B | BUS-63125-B | BUS-63357-B | BUS-63357-883B | BUS-63102-B | |
|---|---|---|---|---|---|
| 描述 | Line Driver/Receiver, 1 Driver, Hybrid, MDIP24 | Line Driver/Receiver, 2 Driver, Hybrid, MDIP36, | Line Driver/Receiver, 2 Driver, Hybrid, CDIP24 | Line Driver/Receiver, 2 Driver, Hybrid, CDIP24 | Line Driver/Receiver, 1 Driver, Hybrid, MDIP24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 差分输出 | YES | YES | YES | YES | YES |
| 驱动器位数 | 1 | 2 | 2 | 2 | 1 |
| 高电平输入电流最大值 | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A |
| JESD-30 代码 | R-MDIP-T24 | R-MDIP-T36 | R-XDIP-T24 | R-XDIP-T24 | R-MDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 24 | 36 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 最大输出低电流 | 0.004 A | 0.016 A | 0.016 A | 0.016 A | 0.004 A |
| 封装主体材料 | METAL | METAL | CERAMIC | CERAMIC | METAL |
| 封装代码 | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,1.1 | DIP36,.6 | DIP24,.6 | DIP24,.6 | DIP24,1.1 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5,+-12/+-15 V | 5,+-15 V | 5,-12 V | 5,-12 V | 5,+-12/+-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 包装说明 | DIP, DIP24,1.1 | DIP, DIP36,.6 | - | DIP, DIP24,.6 | - |
| 厂商名称 | - | - | Data Device Corporation | Data Device Corporation | Data Device Corporation |
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