NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS
| 参数名称 | 属性值 |
| 包装说明 | DIE, |
| Reach Compliance Code | unknown |
| 系列 | HC/UH |
| JESD-30 代码 | X-XUUC-N14 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | NAND GATE |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 传播延迟（tpd） | 18 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| Base Number Matches | 1 |
| HCS00HMSR | 5962R9572401VCC | HCS00D/SAMPLE | 5962R9572401VXC | 5962R9572401V9A | HCS00K/SAMPLE | HCS00DMSR | HCS00KMSR | |
|---|---|---|---|---|---|---|---|---|
| 描述 | NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS | NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14 | NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14 | NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14 | NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS | NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14 | NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDIP14 | NAND Gate, HC/UH Series, 4-Func, 2-Input, CMOS, CDFP14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | X-XUUC-N14 | R-CDIP-T14 | R-CDIP-T14 | R-CDFP-F14 | X-XUUC-N14 | R-CDFP-F14 | R-CDIP-T14 | R-CDFP-F14 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 封装主体材料 | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | UNCASED CHIP | IN-LINE | IN-LINE | FLATPACK | UNCASED CHIP | FLATPACK | IN-LINE | FLATPACK |
| 传播延迟（tpd） | 18 ns | 20 ns | 18 ns | 20 ns | 18 ns | 18 ns | 20 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | FLAT | THROUGH-HOLE | FLAT |
| 端子位置 | UPPER | DUAL | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL |
| 最高工作温度 | 125 °C | 125 °C | - | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C | - | -55 °C | -55 °C |
| 温度等级 | MILITARY | MILITARY | - | MILITARY | MILITARY | - | MILITARY | MILITARY |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| JESD-609代码 | - | e4 | - | e4 | e0 | - | e0 | e0 |
| 端子面层 | - | GOLD | - | GOLD | TIN LEAD | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 总剂量 | - | 100k Rad(Si) V | - | 100k Rad(Si) V | 100k Rad(Si) V | - | 200k Rad(Si) V | 200k Rad(Si) V |
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