Programmable Logic Device, PAL-Type, CMOS, CDIP24,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 33.3 MHz |
| JESD-30 代码 | R-XDIP-T24 |
| JESD-609代码 | e0 |
| 输入次数 | 22 |
| 输出次数 | 10 |
| 产品条款数 | 132 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| PALC22V10H25CJS | PALC22V10H25CFN | PALC22V10H25CNS | PALC22V10H25CQS | PALC22V10H35CFN | PALC22V10H35CJS | PALC22V10H35CNS | PALC22V10H35CQS | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Programmable Logic Device, PAL-Type, CMOS, CDIP24, | Programmable Logic Device, PAL-Type, CMOS, PQCC28, | Programmable Logic Device, PAL-Type, CMOS, PDIP24, | Programmable Logic Device, PAL-Type, CMOS, CDIP24, | Programmable Logic Device, PAL-Type, CMOS, PQCC28, | Programmable Logic Device, PAL-Type, CMOS, CDIP24, | Programmable Logic Device, PAL-Type, CMOS, PDIP24, | Programmable Logic Device, PAL-Type, CMOS, CDIP24, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 33.3 MHz | 33.3 MHz | 33.3 MHz | 33.3 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| JESD-30 代码 | R-XDIP-T24 | S-PQCC-J28 | R-PDIP-T24 | R-XDIP-T24 | S-PQCC-J28 | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 输入次数 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
| 输出次数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 产品条款数 | 132 | 132 | 132 | 132 | 132 | 132 | 132 | 132 |
| 端子数量 | 24 | 28 | 24 | 24 | 28 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC | PLASTIC | PLASTIC | CERAMIC | PLASTIC | CERAMIC | PLASTIC | CERAMIC |
| 封装代码 | DIP | QCCJ | DIP | DIP | QCCJ | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| 包装说明 | DIP, DIP24,.3 | - | DIP, DIP24,.3 | DIP, DIP24,.3 | - | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
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