Speech Synthesizer With RCDG, 10s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
零件包装代码 | SOIC |
包装说明 | SOP, SOP28,.4 |
针数 | 28 |
Reach Compliance Code | unknown |
应用 | CAR STEREO; HANDSET; TRANSFORMER |
商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG |
JESD-30 代码 | R-PDSO-G28 |
长度 | 17.93 mm |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 28 |
片上内存类型 | EEPROM |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP28,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
认证状态 | Not Qualified |
最长读取时间 | 10 s |
座面最大高度 | 2.64 mm |
最大压摆率 | 30 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 7.52 mm |
Base Number Matches | 1 |
ISD1110SY | ISD1112P | ISD1112X | ISD1112PY | ISD1112S | ISD1110PY | |
---|---|---|---|---|---|---|
描述 | Speech Synthesizer With RCDG, 10s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28 | Speech Synthesizer With RCDG, 12s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Speech Synthesizer With RCDG, 12s, CMOS, DIE-28 | Speech Synthesizer With RCDG, 12s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28 | Speech Synthesizer With RCDG, 12s, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 | Speech Synthesizer With RCDG, 10s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 符合 |
零件包装代码 | SOIC | DIP | DIE | DIP | SOIC | DIP |
包装说明 | SOP, SOP28,.4 | DIP, DIP28,.6 | DIE, | DIP, DIP28,.6 | SOP, SOP28,.4 | DIP, DIP28,.6 |
针数 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
应用 | CAR STEREO; HANDSET; TRANSFORMER | CAR STEREO; HANDSET; TRANSFORMER | CAR STEREO; HANDSET; TRANSFORMER | CAR STEREO; HANDSET; TRANSFORMER | CAR STEREO; HANDSET; TRANSFORMER | CAR STEREO; HANDSET; TRANSFORMER |
商用集成电路类型 | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG | SPEECH SYNTHESIZER WITH RCDG |
JESD-30 代码 | R-PDSO-G28 | R-PDIP-T28 | R-XUUC-N28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
片上内存类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
最高工作温度 | 70 °C | 70 °C | 50 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | DIE | DIP | SOP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | UNCASED CHIP | IN-LINE | SMALL OUTLINE | IN-LINE |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最长读取时间 | 10 s | 12 s | 12 s | 12 s | 12 s | 10 s |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 6.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
表面贴装 | YES | NO | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子位置 | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
长度 | 17.93 mm | 36.83 mm | - | 36.83 mm | 17.93 mm | 36.83 mm |
封装等效代码 | SOP28,.4 | DIP28,.6 | - | DIP28,.6 | SOP28,.4 | DIP28,.6 |
电源 | 5 V | 5 V | - | 5 V | 5 V | 5 V |
座面最大高度 | 2.64 mm | 4.83 mm | - | 4.83 mm | 2.64 mm | 4.83 mm |
最大压摆率 | 30 mA | 30 mA | - | 30 mA | 30 mA | 30 mA |
端子节距 | 1.27 mm | 2.54 mm | - | 2.54 mm | 1.27 mm | 2.54 mm |
宽度 | 7.52 mm | 15.24 mm | - | 15.24 mm | 7.52 mm | 15.24 mm |
厂商名称 | - | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | - |
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