CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied
NOTE:
1.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
Unless Otherwise Specified, Typical Parameters are at T
A
= 25
o
C, Min-Max Parameters are over
Operating Temperature Range, V
BAT
= -24V, V
CC
= +5V, AGND = BGND = 0V. All AC Parameters are specified
at 600Ω 2-Wire terminating impedance.
TEST CONDITIONS
MIN
TYP
MAX
UNITS
PARAMETER
RINGING TRANSMISSION PARAMETERS
V
RING
Input Impedance
4-Wire to 2-Wire Gain
AC TRANSMISSION PARAMETERS
RX Input Impedance
OUT1 Positive Output Voltage Swing
OUT1 Negative Output Voltage Swing
4-Wire Input Overload Level
(Note 2)
-
-
5.4
40
-
-
kΩ
V/V
V
RING
to V
T-R
(Note 2)
300Hz to 3.4kHz (Note 2)
R
L
= 10kΩ (Note 2)
R
L
= 10kΩ (Note 2)
300Hz to 3.4kHz R
L
= 1200Ω, 600Ω Reference
(Note 2)
Matched for 600Ω, f = 300Hz (Note 2)
Matched for 600Ω, f = 1000Hz (Note 2)
Matched for 600Ω, f = 3400Hz (Note 2)
-
+2.5
-4.5
-
108
-
-
+3.1
-
-
-
-
kΩ
V
V
V
PEAK
dB
dB
dB
dB
2-Wire Return Loss
37
40
30
58
-
-
-
63
-
-
-
-
2-Wire Longitudinal to Metallic Balance
Off Hook
4-Wire Longitudinal Balance Off Hook
Longitudinal Current Capability
Insertion Loss, 2W-4W
Insertion Loss, 4W-2W
Insertion Loss, 4W-4W
Frequency Response
Per ANSI/IEEE STD 455-1976 300Hz to 3400Hz
(Note 2)
300Hz to 3400Hz (Note 2)
I
LINE
= 40mA, T
A
= 25
o
C (Note 2)
0dBmO, 1kHz, Includes Tranhybrid Amp Gain = 3
0dBmO,1kHz
0dBmO, 1kHz, Includes Tranhybrid Amp Gain = 3
300Hz to 3400Hz Referenced to Absolute Level
at 1kHz, 0dBm Referenced 600Ω
-
-
-
-
-
-
55
40
±0.05
±0.05
-
±0.02
-
-
±0.2
±0.2
±0.25
±0.06
dB
mA
RMS
dB
dB
dB
dB
63
HC55171
Electrical Specifications
Unless Otherwise Specified, Typical Parameters are at T
A
= 25
o
C, Min-Max Parameters are over
Operating Temperature Range, V
BAT
= -24V, V
CC
= +5V, AGND = BGND = 0V. All AC Parameters are specified
at 600Ω 2-Wire terminating impedance.
(Continued)
TEST CONDITIONS
+3 to 0dBm, Referenced to -10dBm (Note 2)
0 to -40dBm, Referenced to -10dBm (Note 2)
-40 to -55dBm, Referenced to -10dBm (Note 2)
Absolute Delay, 2W-4W
Absolute Delay, 4W-2W
Absolute Delay, 4W-4W
Transhybrid Loss
Total Harmonic Distortion
2-Wire/4-Wire, 4-Wire/2-Wire, 4-Wire/4-Wire
Idle Channel Noise
2-Wire and 4-Wire
PSRR, V
CC
to 2W
PSRR, V
CC
to 4W
PSRR, VBAT to 2W
PSRR, VBAT to 4W
PSRR, V
CC
to 2W
PSRR, V
CC
to 4W
PSRR, VBAT to 2W
PSRR, VBAT to 4W
PSRR, V
CC
to 2W
PSRR, V
CC
to 4W
PSRR, VBAT to 2W
PSRR, VBAT to 4W
DC PARAMETERS
Loop Current Programming Range
Loop Current Programming Accuracy
Loop Current During Power Denial
Fault Current, Tip to Ground
Fault Current, Ring to Ground
Fault Current, Tip and Ring to Ground
Switch Hook Detection Threshold
Ring Trip Comparator Voltage Threshold
Thermal ALARM Output
Safe Operating Die Temperature Exceeded
(Note 2)
(Note 2)
(Note 2)
R
L
= 200Ω, V
BAT
= -48V
(Note 2)
(Note 3)
20
-10
-
-
-
-
9
-0.28
-
-
-
±4
90
100
130
12
-0.24
160
60
+10
-
-
-
-
15
-0.22
-
mA
%
mA
mA
mA
mA
mA
V
o
C
PARAMETER
Level Linearity
MIN
-
-
-
-
-
-
36
-
TYP
-
-
-
-
-
0.95
40
-
MAX
±0.10
±0.12
±0.30
1.0
1.0
-
-
-50
UNITS
dB
dB
dB
µs
µs
µs
dB
dB
300Hz to 3400Hz (Note 2)
300Hz to 3400Hz (Note 2)
300Hz to 3400Hz (Note 2)
V
IN
= 1V
P-P
at 1kH (Note 2)
Reference Level 0dBm at 600Ω
300Hz to 3400Hz (Note 2)
C-Message (Note 2)
Psophometric (Note 2)
30Hz to 200Hz, R
L
= 600Ω (Note 2)
-
-
30
45
23
33
3
-87
35
47
28
38
35
46
50
60
34
40
40
50
-
-
-
-
-
-
-
-
-
-
-
-
-
-
dBrnC
dBmp
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
200Hz to 3.4kHz, R
L
= 600Ω (Note 2)
33
44
40
50
3.4kHz to 16kHz, R
L
= 600Ω (Note 2)
30
35
30
40
Dial Pulse Distortion
-
0.1
0.5
ms
64
HC55171
Electrical Specifications
Unless Otherwise Specified, Typical Parameters are at T
A
= 25
o
C, Min-Max Parameters are over
Operating Temperature Range, V
BAT
= -24V, V
CC
= +5V, AGND = BGND = 0V. All AC Parameters are specified
at 600Ω 2-Wire terminating impedance.
(Continued)
TEST CONDITIONS
MIN
TYP
MAX
UNITS
PARAMETER
UNCOMMITTED RELAY DRIVER
On Voltage, V
OL
Off Leakage Current
TTL/CMOS LOGIC INPUTS (F0, F1, RS, TST, RDI)
Logic Low Input Voltage
Logic High Input Voltage
Input Current
Input Current
LOGIC OUTPUTS (SHD, RTD, ALM)
Logic Low Output Voltage
Logic High Output Voltage
POWER DISSIPATION
Power Dissipation On Hook
I
OL
(RDO) = 30mA
-
-
0.2
±10
0.5
±100
V
µA
0
2.0
I
IH
, 0V
≤
V
IN
≤
5V
I
IL
, 0V
≤
V
IN
≤
5V
-
-
-
-
-
-
0.8
5.5
-1
-100
V
V
µA
µA
I
LOAD
= 800µA
I
LOAD
= 40µA
-
2.7
-
0.1
-
-
300
150
280
0.5
5.5
-
-
-
-
V
V
V
CC
= +5V, V
BAT
= -80V, R
LOOP
=
V
CC
= +5V, V
BAT
= -48V, R
LOOP
=
∞
∞
-
-
-
mW
mW
mW
Power Dissipation Off Hook
V
CC
= +5V, V
BAT
= -24V, R
LOOP
= 600Ω,
I
L
= 25mA
V
CC
= +5V, V
BAT
= -80V, R
LOOP
=
V
CC
= +5V, V
BAT
= -48V, R
LOOP
=
V
CC
= +5V, V
BAT
= -24V, R
LOOP
=
I
CC
∞
∞
∞
-
-
-
-
-
-
3
2
1.9
3.6
2.6
2.3
6
5
5
7
6
4.5
mA
mA
mA
mA
mA
mA
I
BAT
V
CC
= +5V, V
B
- = -80V, R
LOOP
=
V
CC
= +5V, V
B
- = -48V, R
LOOP
=
V
CC
= +5V, V
B
- = -24V, R
LOOP
=
∞
∞
∞
NOTES:
2. These parameters are controlled by design or process parameters and are not directly tested. These parameters are characterized upon
initial design release, upon design changes which would affect these characteristics, and at intervals to assure product quality and
specification compliance.
3. This parameter directly affects device junction temperature. Refer to Power Dissipation discussion of data sheet for design information.
65
HC55171
Functional Diagram
R
TF
R
V
RX
17
OUT 1
12
-IN 1
13
V
RING
24
V
TX
19
V
CC
2
BIAS
NETWORK
AGND
1
22
TF
25
-
+
R
R/2
+2V
R/20
R
R
2R
BGND
-
+
OP AMP
27
4
5
V
BAT
F1
F0
RS
TST
4.5K
100K
RING
SENSE 1
RING
SENSE 2
15
100K
100K
16
100K
4.5K
90K
+
25K
FAULT
DET
25K
RA
RTD
THERM
LTD
TSD
IIL LOGIC INTERFACE
TIP
SENSE
14
R
R
+
2R
-
TA
SHD
SH
6
9
GK
-
7
8
RFC
10
SHD
RTD
ALM
RDO
90K
26
RF
RF
+
-
90K
GM
VB/2
REF
18
NU
28
RTI
-
+
RF2
21
R = 108kΩ
3
V
REF
11
I
LMT
20
RDI
HC55171 DEVICE TRUTH TABLE
F1
0
0
1
1
F0
0
1
0
1
STATE
Loop power Denial Active
Power Down Latch RESET, Power on
RESET
RD Active
Normal Loop feed
Power Dissipation
Careful thermal design is required to guarantee that the
maximum junction temperature of 150
o
C of the device is not
exceeded. The junction temperature of the SLIC can be cal-
culated using:
T
J
=
T
A
+
θ
JA
(
I
CC
V
CC
+
I
BAT
V
BAT
–
( (
I
LOOP
) •
R
LOOP
) )
(EQ. 1)
2
The truth table for the internal logic of the HC55171 is pro-
vided in the above table. This family of ringing SLICS can be
configured to support traditional unbalanced ringing and thru
SLIC balanced ringing. Refer to the HC5509A1R3060 for
unbalanced ringing application information. The device oper-
ating states used by thru SLIC ringing applications are loop
power denial and normal feed. During loop power denial, the
tip and ring amplifiers are disabled (high impedance) and the
DC voltage of each amplifier approaches ground. The SLIC
will not provide current to the subscriber loop during this mode
and will not detect loop closure. Voice transmission occurs
during the normal loop feed mode. During normal loop feed
the SLIC is completely operational and performs all transmis-
sion and supervisory functions.
Where T
A
is maximum ambient temperature and
θ
JA
is junc-
tion to air thermal resistance (and is package dependent).
The entire term in parentheses yields the SLIC power dissi-
pation. The power dissipation of the subscriber loop does
not contribute to device junction temperature and is sub-
tracted from the power dissipation term. Operating at 85
o
C,
the maximum PLCC SLIC power dissipation is 1.18W. Like-
wise, the maximum SOIC SLIC power dissipation is 0.92W.
FPGA/CPLD
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