OTP ROM, 32X8, 55ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最长访问时间 | 55 ns |
| JESD-30 代码 | R-CDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.431 mm |
| 内存密度 | 256 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 字数 | 32 words |
| 字数代码 | 32 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 组织 | 32X8 |
| 输出特性 | OPEN-COLLECTOR |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| AM27LS18DCB | AM27LS18PC | AM27LS18PCB | AM27LS18DC | AM27LS19LCB | AM27LS18LCB | AM27LS19DCB | AM27LS18LC | AM27LS19DC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 32X8, 55ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | OTP ROM, 32X8, 55ns, Bipolar, PDIP16, PLASTIC, DIP-16 | OTP ROM, 32X8, 55ns, Bipolar, PDIP16, PLASTIC, DIP-16 | OTP ROM, 32X8, 55ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | OTP ROM, 32X8, 55ns, Bipolar, CQCC20, CERAMIC, LCC-20 | OTP ROM, 32X8, 55ns, Bipolar, CQCC20, CERAMIC, LCC-20 | OTP ROM, 32X8, 55ns, Bipolar, CDIP16, CERAMIC, DIP-16 | OTP ROM, 32X8, 55ns, Bipolar, CQCC20, CERAMIC, LCC-20 | OTP ROM, 32X8, 55ns, Bipolar, CDIP16, CERAMIC, DIP-16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIP | DIP | QLCC | QLCC | DIP | QLCC | DIP |
| 包装说明 | DIP, DIP16,.3 | PLASTIC, DIP-16 | PLASTIC, DIP-16 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | CERAMIC, DIP-16 |
| 针数 | 16 | 16 | 16 | 16 | 20 | 20 | 16 | 20 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | - | 含铅 | 含铅 |
| 最长访问时间 | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns | - | 55 ns | 55 ns |
| JESD-30 代码 | R-CDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-CDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | - | S-CQCC-N20 | R-GDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 |
| 长度 | 19.431 mm | 19.1135 mm | 19.1135 mm | 19.431 mm | 8.89 mm | 8.89 mm | - | 8.89 mm | 19.431 mm |
| 内存密度 | 256 bit | 256 bit | 256 bit | 256 bit | 256 bit | 256 bit | - | 256 bit | 256 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | - | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 20 | 20 | - | 20 | 16 |
| 字数 | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words | - | 32 words | 32 words |
| 字数代码 | 32 | 32 | 32 | 32 | 32 | 32 | - | 32 | 32 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | - | 75 °C | 75 °C |
| 组织 | 32X8 | 32X8 | 32X8 | 32X8 | 32X8 | 32X8 | - | 32X8 | 32X8 |
| 输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | 3-STATE | OPEN-COLLECTOR | - | OPEN-COLLECTOR | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | QCCN | QCCN | - | QCCN | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LCC20,.35SQ | LCC20,.35SQ | - | LCC20,.35SQ | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | - | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | - | CHIP CARRIER | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | - | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | - | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | YES | YES | - | YES | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | - | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | - | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | - | 8.89 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
| 厂商名称 | - | AMD(超微) | AMD(超微) | - | - | - | AMD(超微) | AMD(超微) | AMD(超微) |
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