IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 计数方向 | UP |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 负载/预设输入 | YES |
| 逻辑集成电路类型 | BINARY COUNTER |
| 最大频率@ Nom-Sup | 30000000 Hz |
| 最大I（ol） | 0.004 A |
| 工作模式 | SYNCHRONOUS |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 2/6 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| MC74HC161AN | 54HC163/BEAJC | 54HC161/BEAJC | 54HC163M/B2AJC | 54HC161M/B2AJC | MC74HC163AN | MC54HC163AJ | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,PLASTIC | IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC | IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC | IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,LLCC,20PIN,CERAMIC | IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,LLCC,20PIN,CERAMIC | IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,PLASTIC | IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 计数方向 | UP | UP | UP | UP | UP | UP | UP |
| JESD-30 代码 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | S-XQCC-N20 | S-XQCC-N20 | R-PDIP-T16 | R-XDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载/预设输入 | YES | YES | YES | YES | YES | YES | YES |
| 逻辑集成电路类型 | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 20 | 20 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DIP | DIP | QCCN | QCCN | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LCC20,.35SQ | LCC20,.35SQ | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
| 筛选级别 | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | - |
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