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M58LW032A90ZA1

产品描述2MX16 FLASH 3V PROM, 90ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64
产品类别存储    存储   
文件大小856KB,共61页
制造商ST(意法半导体)
官网地址http://www.st.com/
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M58LW032A90ZA1概述

2MX16 FLASH 3V PROM, 90ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64

M58LW032A90ZA1规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称ST(意法半导体)
零件包装代码BGA
包装说明10 X 13 MM, 1 MM PITCH, TBGA-64
针数64
Reach Compliance Codenot_compliant
ECCN代码3A991.B.1.A
Is SamacsysN
最长访问时间90 ns
其他特性SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
命令用户界面YES
通用闪存接口YES
数据轮询NO
JESD-30 代码R-PBGA-B64
JESD-609代码e0
长度13 mm
内存密度33554432 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
部门数/规模64
端子数量64
字数2097152 words
字数代码2000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2MX16
封装主体材料PLASTIC/EPOXY
封装代码TBGA
封装等效代码BGA64,8X8,40
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE
页面大小4 words
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源2/3.3,3/3.3 V
编程电压3 V
认证状态Not Qualified
就绪/忙碌YES
座面最大高度1.2 mm
部门规模32K
最大待机电流0.00004 A
最大压摆率0.03 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
切换位NO
类型NOR TYPE
宽度10 mm
Base Number Matches1

文档预览

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M58LW032A
32 Mbit (2Mb x16, Uniform Block, Burst)
3V Supply Flash Memory
FEATURES SUMMARY
s
WIDE x16 DATA BUS for HIGH BANDWIDTH
s
Figure 1. Packages
SUPPLY VOLTAGE
– V
DD
= 2.7 to 3.6V core supply voltage for Pro-
gram, Erase and Read operations
– V
DDQ
= 1.8V to V
DD
for I/O Buffers
s
SYNCHRONOUS/ASYNCHRONOUS READ
– Synchronous Burst read
– Asynchronous Random Read
– Asynchronous Address Latch Controlled
Read
– Page Read
TSOP56 (N)
14 x 20 mm
s
ACCESS TIME
– Synchronous Burst Read up to 56MHz
– Asynchronous Page Mode Read 90/25ns and
110/25ns
– Random Read 90ns, 110ns.
TBGA
TBGA64 (ZA)
10 x 13 mm
s
PROGRAMMING TIME
– 16 Word Write Buffer
– 18µs Word effective programming time
s
s
s
s
s
s
64 UNIFORM 32 KWord MEMORY BLOCKS
BLOCK PROTECTION/ UNPROTECTION
PROGRAM and ERASE SUSPEND
128 bit PROTECTION REGISTER
COMMON FLASH INTERFACE
100, 000 PROGRAM/ERASE CYCLES per
BLOCK
ELECTRONIC SIGNATURE
– Manufacturer Code: 0020h
– Device Code M58LW032A: 8816h
s
February 2003
1/61

M58LW032A90ZA1相似产品对比

M58LW032A90ZA1 M58LW032A90N6 M58LW032A90ZA6 M58LW032A110N6 M58LW032A110ZA1 M58LW032A110N1 M58LW032A90N1 M58LW032A110ZA6
描述 2MX16 FLASH 3V PROM, 90ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64 2MX16 FLASH 3V PROM, 90ns, PDSO56, 14 X 20 MM, PLASTIC, TSOP-56 2MX16 FLASH 3V PROM, 90ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64 2MX16 FLASH 3V PROM, 110ns, PDSO56, 14 X 20 MM, PLASTIC, TSOP-56 2MX16 FLASH 3V PROM, 110ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64 2MX16 FLASH 3V PROM, 110ns, PDSO56, 14 X 20 MM, PLASTIC, TSOP-56 2MX16 FLASH 3V PROM, 90ns, PDSO56, 14 X 20 MM, PLASTIC, TSOP-56 2MX16 FLASH 3V PROM, 110ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体)
零件包装代码 BGA TSOP BGA TSOP BGA TSOP TSOP BGA
包装说明 10 X 13 MM, 1 MM PITCH, TBGA-64 14 X 20 MM, PLASTIC, TSOP-56 10 X 13 MM, 1 MM PITCH, TBGA-64 14 X 20 MM, PLASTIC, TSOP-56 10 X 13 MM, 1 MM PITCH, TBGA-64 14 X 20 MM, PLASTIC, TSOP-56 14 X 20 MM, PLASTIC, TSOP-56 10 X 13 MM, 1 MM PITCH, TBGA-64
针数 64 56 64 56 64 56 56 64
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
最长访问时间 90 ns 90 ns 90 ns 110 ns 110 ns 110 ns 90 ns 110 ns
其他特性 SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
命令用户界面 YES YES YES YES YES YES YES YES
通用闪存接口 YES YES YES YES YES YES YES YES
数据轮询 NO NO NO NO NO NO NO NO
JESD-30 代码 R-PBGA-B64 R-PDSO-G56 R-PBGA-B64 R-PDSO-G56 R-PBGA-B64 R-PDSO-G56 R-PDSO-G56 R-PBGA-B64
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
长度 13 mm 18.4 mm 13 mm 18.4 mm 13 mm 18.4 mm 18.4 mm 13 mm
内存密度 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1 1
部门数/规模 64 64 64 64 64 64 64 64
端子数量 64 56 64 56 64 56 56 64
字数 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 85 °C 85 °C 85 °C 70 °C 70 °C 70 °C 85 °C
组织 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TBGA TSOP1 TBGA TSOP1 TBGA TSOP1 TSOP1 TBGA
封装等效代码 BGA64,8X8,40 TSSOP56,.8,20 BGA64,8X8,40 TSSOP56,.8,20 BGA64,8X8,40 TSSOP56,.8,20 TSSOP56,.8,20 BGA64,8X8,40
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE
页面大小 4 words 4 words 4 words 4 words 4 words 4 words 4 words 4 words
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V 2/3.3,3/3.3 V
编程电压 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
就绪/忙碌 YES YES YES YES YES YES YES YES
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
部门规模 32K 32K 32K 32K 32K 32K 32K 32K
最大待机电流 0.00004 A 0.00004 A 0.00004 A 0.00004 A 0.00004 A 0.00004 A 0.00004 A 0.00004 A
最大压摆率 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL GULL WING BALL GULL WING BALL GULL WING GULL WING BALL
端子节距 1 mm 0.5 mm 1 mm 0.5 mm 1 mm 0.5 mm 0.5 mm 1 mm
端子位置 BOTTOM DUAL BOTTOM DUAL BOTTOM DUAL DUAL BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
切换位 NO NO NO NO NO NO NO NO
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 10 mm 14 mm 10 mm 14 mm 10 mm 14 mm 14 mm 10 mm
Is Samacsys N N N N N N - -
Base Number Matches 1 1 1 1 1 1 - -

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