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MX29LV400CBTC-70G

产品描述4M X 16 FLASH 3V PROM, 70 ns, PBGA48
产品类别存储    存储   
文件大小903KB,共68页
制造商Macronix
官网地址http://www.macronix.com/en-us/Pages/default.aspx
标准
下载文档 详细参数 全文预览

MX29LV400CBTC-70G概述

4M X 16 FLASH 3V PROM, 70 ns, PBGA48

4M × 16 FLASH 3V 可编程只读存储器, 70 ns, PBGA48

MX29LV400CBTC-70G规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Macronix
零件包装代码TSOP1
包装说明TSOP1, TSSOP48,.8,20
针数48
Reach Compliance Codeunknow
ECCN代码3A991.B.1.A
Factory Lead Time16 weeks
最长访问时间70 ns
备用内存宽度8
启动块BOTTOM
命令用户界面YES
通用闪存接口YES
数据轮询YES
JESD-30 代码R-PDSO-G48
JESD-609代码e3
长度18.4 mm
内存密度67108864 bi
内存集成电路类型FLASH
内存宽度16
湿度敏感等级3
功能数量1
部门数/规模1,2,1,7
端子数量48
字数4194304 words
字数代码4000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织4MX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP1
封装等效代码TSSOP48,.8,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源3/3.3 V
编程电压3 V
认证状态Not Qualified
就绪/忙碌YES
座面最大高度1.2 mm
部门规模16K,8K,32K,64K
最大待机电流0.000005 A
最大压摆率0.03 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
切换位YES
类型NOR TYPE
宽度12 mm

文档预览

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MX29LV400C T/B
4M-BIT [512K x 8 / 256K x 16] CMOS SINGLE VOLTAGE
3V ONLY FLASH MEMORY
FEATURES
• Extended single - supply voltage range 2.7V to 3.6V
• 524,288 x 8/262,144 x 16 switchable
• Single power supply operation
- 3.0V only operation for read, erase and program
operation
Fully compatible with MX29LV400T/B device
• Fast access time: 55R/70/90ns
• Low power consumption
- 30mA maximum active current
- 0.2uA typical standby current
• Command register architecture
- Byte/word Programming (9us/11us typical)
- Sector Erase (Sector structure 16K-Byte x 1,
8K-Byte x 2, 32K-Byte x1, and 64K-Byte x7)
• Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors with
Erase Suspend capability
- Automatically program and verify data at specified
address
• Erase suspend/Erase Resume
- Suspends sector erase operation to read data from,
or program data to, any sector that is not being erased,
then resumes the erase
• Status Reply
- Data# Polling & Toggle bit for detection of program
and erase operation completion
• Ready/Busy# pin (RY/BY#)
- Provides a hardware method of detecting program or
erase operation completion
• Sector protection
- Hardware method to disable any combination of
sectors from program or erase operations
- Temporary sector unprotect allows code changes in
previously locked sectors
• CFI (Common Flash Interface) compliant
- Flash device parameters stored on the device and
provide the host system to access
• 100,000 minimum erase/program cycles
• Latch-up protected to 100mA from -1V to VCC+1V
• Boot Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
• Package type:
- 44-pin SOP
- 48-pin TSOP
- 48-ball CSP (6 x 8mm)
- 48-ball CSP (4 x 6mm)
-
All Pb-free devices are RoHS Compliant
• Compatibility with JEDEC standard
- Pinout and software compatible with single-power
supply Flash
• 20 years data retention
GENERAL DESCRIPTION
The MX29LV400C T/B is a 4-mega bit Flash memory
organized as 512K bytes of 8 bits or 256K words of 16
bits. MXIC's Flash memories offer the most cost-effec-
tive and reliable read/write non-volatile random access
memory. The MX29LV400C T/B is packaged in 44-pin
SOP, 48-pin TSOP and 48-ball CSP. It is designed to be
reprogrammed and erased in system or in standard
EPROM programmers.
The standard MX29LV400C T/B offers access time as
fast as 55ns, allowing operation of high-speed micropro-
cessors without wait states. To eliminate bus conten-
tion, the MX29LV400C T/B has separate chip enable
(CE#) and output enable (OE#) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29LV400C T/B uses a command register to manage
this functionality. The command register allows for 100%
P/N:PM1155
TTL level control inputs and fixed power supply levels
during erase and programming, while maintaining maxi-
mum EPROM compatibility.
MXIC Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields
for erase and program operations produces reliable cy-
cling. The MX29LV400C T/B uses a 2.7V~3.6V VCC
supply to perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up pro-
tection is proved for stresses up to 100 milliamps on
address and data pin from -1V to VCC + 1V.
REV. 1.5, APR. 24, 2006
1
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