Bus Driver, 100K Series, 1-Func, 6-Bit, Complementary Output, ECL, CDIP24, 0.400 INCH, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 其他特性 | WITH 25 OHM LINE DRIVE CAPABILITY |
| 系列 | 100K |
| JESD-30 代码 | R-GDIP-T24 |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 6 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-EMITTER WITH CUT-OFF |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 2.9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.72 mm |
| 表面贴装 | NO |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| Base Number Matches | 1 |
| 100319DM | 3VN31/9JND12(095) | 100319DMQB | 100319PC | |
|---|---|---|---|---|
| 描述 | Bus Driver, 100K Series, 1-Func, 6-Bit, Complementary Output, ECL, CDIP24, 0.400 INCH, CERAMIC, DIP-24 | SINGLE PART CARD EDGE CONN | Bus Driver, 100K Series, 1-Func, 6-Bit, Complementary Output, ECL, CDIP24, 0.400 INCH, CERAMIC, DIP-24 | Bus Driver, 100K Series, 1-Func, 6-Bit, Complementary Output, ECL, PDIP24, PLASTIC, DIP-24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 其他特性 | WITH 25 OHM LINE DRIVE CAPABILITY | NONE | WITH 25 OHM LINE DRIVE CAPABILITY | WITH 25 OHM LINE DRIVE CAPABILITY |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -65 °C | -55 °C | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 零件包装代码 | DIP | - | DIP | DIP |
| 包装说明 | DIP, | - | DIP, | DIP, |
| 针数 | 24 | - | 24 | 24 |
| Is Samacsys | N | - | N | N |
| 系列 | 100K | - | 100K | 100K |
| JESD-30 代码 | R-GDIP-T24 | - | R-GDIP-T24 | R-PDIP-T24 |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 位数 | 6 | - | 6 | 6 |
| 功能数量 | 1 | - | 1 | 1 |
| 端口数量 | 2 | - | 2 | 2 |
| 端子数量 | 24 | - | 24 | 24 |
| 输出特性 | OPEN-EMITTER WITH CUT-OFF | - | OPEN-EMITTER WITH CUT-OFF | OPEN-EMITTER WITH CUT-OFF |
| 输出极性 | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | DIP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 2.9 ns | - | 2.9 ns | 2.3 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 5.72 mm | - | 5.72 mm | 5.08 mm |
| 表面贴装 | NO | - | NO | NO |
| 技术 | ECL | - | ECL | ECL |
| 温度等级 | MILITARY | - | MILITARY | OTHER |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | - | DUAL | DUAL |
| 宽度 | 10.16 mm | - | 10.16 mm | 10.16 mm |
| Base Number Matches | 1 | - | 1 | 1 |
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