EEPROM, 256X8, Serial, CMOS, PDIP8, LEAD AND HALOGEN FREE, PLASTIC, DIP-8
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Catalyst |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 8 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
Is Samacsys | N |
最大时钟频率 (fCLK) | 0.1 MHz |
JESD-30 代码 | R-PDIP-T8 |
JESD-609代码 | e3 |
长度 | 9.59 mm |
内存密度 | 2048 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 256 words |
字数代码 | 256 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 256X8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
串行总线类型 | I2C |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 7.62 mm |
最长写入周期时间 (tWC) | 5 ms |
Base Number Matches | 1 |
CAT34FC02L | CAT34FC02RD7-TE13 | CAT34FC02ZD7-TE13 | CAT34FC02J-TE13 | CAT34FC02Y-TE13 | CAT34FC02U-TE13 | CAT34FC02W-TE13 | |
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描述 | EEPROM, 256X8, Serial, CMOS, PDIP8, LEAD AND HALOGEN FREE, PLASTIC, DIP-8 | EEPROM, 256X8, Serial, CMOS, TDFN-8 | EEPROM, 256X8, Serial, CMOS, LEAD AND HALOGEN FREE, TDFN-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, SOIC-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, TSSOP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, TSSOP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, SOIC-8 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 |
厂商名称 | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
零件包装代码 | DIP | DFN | DFN | SOIC | SOIC | SOIC | SOIC |
包装说明 | DIP, | HVSON, | HVSON, | SOP, | TSSOP, | TSSOP, | SOP, |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
JESD-30 代码 | R-PDIP-T8 | R-XDSO-N8 | R-XDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e3 | e0 | e3 | e0 | e3 | e0 | e3 |
长度 | 9.59 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.4 mm | 4.4 mm | 4.9 mm |
内存密度 | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
字数代码 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | HVSON | HVSON | SOP | TSSOP | TSSOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | 260 | 240 | 260 | NOT SPECIFIED | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 0.8 mm | 0.8 mm | 1.75 mm | 1.1 mm | 1.1 mm | 1.75 mm |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | NO | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | TIN LEAD | Tin (Sn) | TIN LEAD | Tin (Sn) | TIN LEAD | Matte Tin (Sn) |
端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 2.54 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | 40 |
宽度 | 7.62 mm | 3 mm | 3 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm |
最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
是否无铅 | - | 含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 |
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