EEPROM, 256X8, Serial, CMOS, LEAD AND HALOGEN FREE, TDFN-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Catalyst |
| 零件包装代码 | DFN |
| 包装说明 | HVSON, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.1 MHz |
| JESD-30 代码 | R-XDSO-N8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 内存密度 | 2048 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X8 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| CAT34FC02ZD7-TE13 | CAT34FC02L | CAT34FC02RD7-TE13 | CAT34FC02J-TE13 | CAT34FC02Y-TE13 | CAT34FC02U-TE13 | CAT34FC02W-TE13 | |
|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 256X8, Serial, CMOS, LEAD AND HALOGEN FREE, TDFN-8 | EEPROM, 256X8, Serial, CMOS, PDIP8, LEAD AND HALOGEN FREE, PLASTIC, DIP-8 | EEPROM, 256X8, Serial, CMOS, TDFN-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, SOIC-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, TSSOP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, TSSOP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD AND HALOGEN FREE, SOIC-8 |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 符合 |
| 厂商名称 | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
| 零件包装代码 | DFN | DIP | DFN | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | HVSON, | DIP, | HVSON, | SOP, | TSSOP, | TSSOP, | SOP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
| JESD-30 代码 | R-XDSO-N8 | R-PDIP-T8 | R-XDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e0 | e0 | e3 | e0 | e3 |
| 长度 | 4.9 mm | 9.59 mm | 4.9 mm | 4.9 mm | 4.4 mm | 4.4 mm | 4.9 mm |
| 内存密度 | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | DIP | HVSON | SOP | TSSOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | 240 | 260 | NOT SPECIFIED | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 4.57 mm | 0.8 mm | 1.75 mm | 1.1 mm | 1.1 mm | 1.75 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | NO | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin (Sn) | Matte Tin (Sn) | TIN LEAD | TIN LEAD | Tin (Sn) | TIN LEAD | Matte Tin (Sn) |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 2.54 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 40 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | 40 |
| 宽度 | 3 mm | 7.62 mm | 3 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 是否无铅 | 不含铅 | - | 含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 |
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