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STM6600CS25DM6F |
STM6601CM2DDM6F |
STM6601CQ2BDM6F |
STM6601CA2BDM6F |
STM6600DU25DM6F |
描述 |
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监控的组数:1 电源管理芯片的类型:智能型开/关控制器 有效的复位电平:低有效 输出端类型:开路漏极或开路集电极 复位阀值电压:3.1V |
3.3V |
监控的组数:1 电源管理芯片的类型:智能型开/关控制器 有效的复位电平:低有效 输出端类型:开路漏极或开路集电极 复位阀值电压:2.5V Controller1.6Vto5.5V12-PinTDFNT/R |
监控的组数:1 电源管理芯片的类型:智能型开/关控制器 有效的复位电平:低有效 输出端类型:开路漏极或开路集电极 复位阀值电压:3.5V |
Brand Name |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
12 weeks |
12 weeks |
12 weeks |
12 weeks |
12 weeks |
模拟集成电路 - 其他类型 |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
NOT SPECIFIED |
260 |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
30 |
30 |
NOT SPECIFIED |
NOT SPECIFIED |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
零件包装代码 |
DFN |
DFN |
DFN |
- |
DFN |
包装说明 |
VSON, SOLCC12,.08,20 |
VSON, SOLCC12,.08,20 |
VSON, SOLCC12,.08,20 |
- |
VSON, SOLCC12,.08,20 |
针数 |
12 |
12 |
12 |
- |
12 |
其他特性 |
RESET THRESHOLD VOLTAGE IS 3.4V |
RESET THRESHOLD VOLTAGE IS 3.1V |
RESET THRESHOLD VOLTAGE IS 3.3V |
- |
RESET THRESHOLD VOLTAGE IS 3.5V |
可调阈值 |
NO |
NO |
NO |
- |
NO |
JESD-30 代码 |
R-PDSO-N12 |
R-PDSO-N12 |
R-PDSO-N12 |
- |
R-PDSO-N12 |
JESD-609代码 |
e4 |
e4 |
e4 |
- |
e4 |
长度 |
3 mm |
3 mm |
3 mm |
- |
3 mm |
湿度敏感等级 |
1 |
1 |
1 |
- |
1 |
信道数量 |
1 |
1 |
1 |
- |
1 |
功能数量 |
1 |
1 |
1 |
- |
1 |
端子数量 |
12 |
12 |
12 |
- |
12 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
- |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
封装代码 |
VSON |
VSON |
VSON |
- |
VSON |
封装等效代码 |
SOLCC12,.08,20 |
SOLCC12,.08,20 |
SOLCC12,.08,20 |
- |
SOLCC12,.08,20 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, VERY THIN PROFILE |
SMALL OUTLINE, VERY THIN PROFILE |
- |
SMALL OUTLINE, VERY THIN PROFILE |
电源 |
1.8/5 V |
1.8/5 V |
1.8/5 V |
- |
1.8/5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
座面最大高度 |
0.8 mm |
0.8 mm |
0.8 mm |
- |
0.8 mm |
最大供电电流 (Isup) |
0.008 mA |
0.008 mA |
0.008 mA |
- |
0.008 mA |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
- |
5.5 V |
最小供电电压 (Vsup) |
1.6 V |
1.6 V |
1.6 V |
- |
1.6 V |
标称供电电压 (Vsup) |
2 V |
2 V |
2 V |
- |
2 V |
表面贴装 |
YES |
YES |
YES |
- |
YES |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
NO LEAD |
NO LEAD |
NO LEAD |
- |
NO LEAD |
端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
- |
0.5 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
- |
DUAL |
宽度 |
2 mm |
2 mm |
2 mm |
- |
2 mm |
厂商名称 |
- |
ST(意法半导体) |
ST(意法半导体) |
ST(意法半导体) |
- |