3.3V
参数名称 | 属性值 |
Brand Name | STMicroelectronics |
厂商名称 | ST(意法半导体) |
零件包装代码 | DFN |
包装说明 | VSON, SOLCC12,.08,20 |
针数 | 12 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 12 weeks |
Samacsys Description | STMICROELECTRONICS - STM6601CQ2BDM6F - SUPERVISOR, RESET, 5.5V, TDFN-12 |
其他特性 | RESET THRESHOLD VOLTAGE IS 3.3V |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码 | R-PDSO-N12 |
JESD-609代码 | e4 |
长度 | 3 mm |
湿度敏感等级 | 1 |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 12 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VSON |
封装等效代码 | SOLCC12,.08,20 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 1.8/5 V |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大供电电流 (Isup) | 0.008 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.6 V |
标称供电电压 (Vsup) | 2 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 2 mm |
Base Number Matches | 1 |
STM6601CQ2BDM6F | STM6600CS25DM6F | STM6601CM2DDM6F | STM6601CA2BDM6F | STM6600DU25DM6F | |
---|---|---|---|---|---|
描述 | 3.3V | 监控的组数:1 电源管理芯片的类型:智能型开/关控制器 有效的复位电平:低有效 输出端类型:开路漏极或开路集电极 复位阀值电压:3.1V | 监控的组数:1 电源管理芯片的类型:智能型开/关控制器 有效的复位电平:低有效 输出端类型:开路漏极或开路集电极 复位阀值电压:2.5V Controller1.6Vto5.5V12-PinTDFNT/R | 监控的组数:1 电源管理芯片的类型:智能型开/关控制器 有效的复位电平:低有效 输出端类型:开路漏极或开路集电极 复位阀值电压:3.5V | |
Brand Name | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 12 weeks | 12 weeks | 12 weeks | 12 weeks | 12 weeks |
模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
峰值回流温度(摄氏度) | 260 | 260 | 260 | NOT SPECIFIED | 260 |
处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
厂商名称 | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | - |
零件包装代码 | DFN | DFN | DFN | - | DFN |
包装说明 | VSON, SOLCC12,.08,20 | VSON, SOLCC12,.08,20 | VSON, SOLCC12,.08,20 | - | VSON, SOLCC12,.08,20 |
针数 | 12 | 12 | 12 | - | 12 |
其他特性 | RESET THRESHOLD VOLTAGE IS 3.3V | RESET THRESHOLD VOLTAGE IS 3.4V | RESET THRESHOLD VOLTAGE IS 3.1V | - | RESET THRESHOLD VOLTAGE IS 3.5V |
可调阈值 | NO | NO | NO | - | NO |
JESD-30 代码 | R-PDSO-N12 | R-PDSO-N12 | R-PDSO-N12 | - | R-PDSO-N12 |
JESD-609代码 | e4 | e4 | e4 | - | e4 |
长度 | 3 mm | 3 mm | 3 mm | - | 3 mm |
湿度敏感等级 | 1 | 1 | 1 | - | 1 |
信道数量 | 1 | 1 | 1 | - | 1 |
功能数量 | 1 | 1 | 1 | - | 1 |
端子数量 | 12 | 12 | 12 | - | 12 |
最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | VSON | VSON | VSON | - | VSON |
封装等效代码 | SOLCC12,.08,20 | SOLCC12,.08,20 | SOLCC12,.08,20 | - | SOLCC12,.08,20 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE |
电源 | 1.8/5 V | 1.8/5 V | 1.8/5 V | - | 1.8/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm |
最大供电电流 (Isup) | 0.008 mA | 0.008 mA | 0.008 mA | - | 0.008 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
最小供电电压 (Vsup) | 1.6 V | 1.6 V | 1.6 V | - | 1.6 V |
标称供电电压 (Vsup) | 2 V | 2 V | 2 V | - | 2 V |
表面贴装 | YES | YES | YES | - | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | - | DUAL |
宽度 | 2 mm | 2 mm | 2 mm | - | 2 mm |
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