1MX16 FLASH 12V PROM, 100ns, PDSO44, 0.500 INCH, PLASTIC, SO-44
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | ST(意法半导体) |
零件包装代码 | SOIC |
包装说明 | 0.500 INCH, PLASTIC, SO-44 |
针数 | 44 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Is Samacsys | N |
最长访问时间 | 100 ns |
命令用户界面 | YES |
数据轮询 | YES |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e3 |
长度 | 28.5 mm |
内存密度 | 16777216 bit |
内存集成电路类型 | FLASH |
内存宽度 | 16 |
功能数量 | 1 |
部门数/规模 | 8 |
端子数量 | 44 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP44,.63 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3/3.3 V |
编程电压 | 12 V |
认证状态 | Not Qualified |
座面最大高度 | 3 mm |
部门规模 | 128K |
最大待机电流 | 0.0001 A |
最大压摆率 | 0.02 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
切换位 | YES |
类型 | NOR TYPE |
宽度 | 12.6 mm |
Base Number Matches | 1 |
M59PW016100M1T | M59PW016100B1 | M59PW016100M1 | M59PW016110M1T | M59PW016110B1 | M59PW016110N1 | M59PW016110N1T | M59PW016110S1 | M59PW016110M1 | M59PW016100S1 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | 1MX16 FLASH 12V PROM, 100ns, PDSO44, 0.500 INCH, PLASTIC, SO-44 | 1MX16 FLASH 12V PROM, 100ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | 1MX16 FLASH 12V PROM, 100ns, PDSO44, 0.500 INCH, PLASTIC, SO-44 | 1MX16 FLASH 12V PROM, 110ns, PDSO44, 0.500 INCH, PLASTIC, SO-44 | 1MX16 FLASH 12V PROM, 110ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | 1MX16 FLASH 12V PROM, 110ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 | 1MX16 FLASH 12V PROM, 110ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 | 1MX16 FLASH 12V PROM, 110ns, PDIP42, 0.600 INCH, PLASTIC, SDIP-42 | 1MX16 FLASH 12V PROM, 110ns, PDSO44, 0.500 INCH, PLASTIC, SO-44 | 1MX16 FLASH 12V PROM, 100ns, PDIP42, 0.600 INCH, PLASTIC, SDIP-42 |
零件包装代码 | SOIC | DIP | SOIC | SOIC | DIP | TSOP | TSOP | DIP | SOIC | DIP |
包装说明 | 0.500 INCH, PLASTIC, SO-44 | 0.600 INCH, PLASTIC, DIP-42 | 0.500 INCH, PLASTIC, SO-44 | 0.500 INCH, PLASTIC, SO-44 | 0.600 INCH, PLASTIC, DIP-42 | TSOP1, TSSOP48,.8,20 | TSOP1, TSSOP48,.8,20 | SDIP, SDIP42,.6 | 0.500 INCH, PLASTIC, SO-44 | SDIP, SDIP42,.6 |
针数 | 44 | 42 | 44 | 44 | 42 | 48 | 48 | 42 | 44 | 42 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | unknown | unknown | unknown | compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 100 ns | 100 ns | 100 ns | 110 ns | 110 ns | 110 ns | 110 ns | 110 ns | 110 ns | 100 ns |
命令用户界面 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | R-PDSO-G44 | R-PDIP-T42 | R-PDSO-G44 | R-PDSO-G44 | R-PDIP-T42 | R-PDSO-G48 | R-PDSO-G48 | R-PDIP-T42 | R-PDSO-G44 | R-PDIP-T42 |
长度 | 28.5 mm | 52.455 mm | 28.5 mm | 28.5 mm | 52.455 mm | 18.4 mm | 18.4 mm | 36.83 mm | 28.5 mm | 36.83 mm |
内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
部门数/规模 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 44 | 42 | 44 | 44 | 42 | 48 | 48 | 42 | 44 | 42 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | SOP | SOP | DIP | TSOP1 | TSOP1 | SDIP | SOP | SDIP |
封装等效代码 | SOP44,.63 | DIP42,.6 | SOP44,.63 | SOP44,.63 | DIP42,.6 | TSSOP48,.8,20 | TSSOP48,.8,20 | SDIP42,.6 | SOP44,.63 | SDIP42,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | IN-LINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE, SHRINK PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
编程电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3 mm | 5.08 mm | 3 mm | 3 mm | 5.08 mm | 1.2 mm | 1.2 mm | 5.08 mm | 3 mm | 5.08 mm |
部门规模 | 128K | 128K | 128K | 128K | 128K | 128K | 128K | 128K | 128K | 128K |
最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
最大压摆率 | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | NO | YES | YES | NO | YES | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.5 mm | 0.5 mm | 1.778 mm | 1.27 mm | 1.778 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
切换位 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 12.6 mm | 15.24 mm | 12.6 mm | 12.6 mm | 15.24 mm | 12 mm | 12 mm | 15.24 mm | 12.6 mm | 15.24 mm |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - | - | 符合 | - |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - | - | - | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | - | - | - | e3 | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | - | - | Matte Tin (Sn) | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved