Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin XSON T/R
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Nexperia |
| 零件包装代码 | SON |
| 包装说明 | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 |
| 针数 | 6 |
| 制造商包装代码 | SOT886 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 13 weeks |
| Samacsys Confidence | 2 |
| Samacsys Status | Released |
| Samacsys PartID | 796112 |
| Samacsys Pin Count | 6 |
| Samacsys Part Category | Integrated Circuit |
| Samacsys Package Category | Other |
| Samacsys Footprint Name | SOT886 |
| Samacsys Released Date | 2019-11-12 07:41:52 |
| Is Samacsys | N |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N6 |
| JESD-609代码 | e3 |
| 长度 | 1.45 mm |
| 逻辑集成电路类型 | BUFFER |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 输入次数 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 传播延迟(tpd) | 13.1 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 1 mm |
| Base Number Matches | 1 |

| 74LVC2G17GM,132 | 74LVC2G17GM,115 | 74LVC2G17GF,132 | 74LVC2G17GV,125 | 74LVC2G17GS,132 | 74LVC2G17GW,125 | |
|---|---|---|---|---|---|---|
| 描述 | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin XSON T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin XSON T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin XSON T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin TSOP T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin XSON T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin TSSOP T/R |
| Brand Name | Nexperia | Nexperia | - | Nexperia | - | Nexperia |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | - | 符合 |
| 厂商名称 | Nexperia | Nexperia | - | Nexperia | - | Nexperia |
| 零件包装代码 | SON | SON | - | TSOP | - | TSSOP |
| 包装说明 | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 | - | TSOP-6 | - | PLASTIC, SC-88, SOT-363, 6 PIN |
| 针数 | 6 | 6 | - | 6 | - | 6 |
| 制造商包装代码 | SOT886 | SOT886 | - | SOT457 | - | SOT363 |
| Reach Compliance Code | compliant | compliant | - | compliant | - | compliant |
| Samacsys Confidence | 2 | 2 | - | 2 | - | 2 |
| Samacsys Status | Released | Released | - | Released | - | Released |
| Samacsys PartID | 796112 | 865737 | - | 645117 | - | 691034 |
| Samacsys Pin Count | 6 | 6 | - | 6 | - | 6 |
| Samacsys Part Category | Integrated Circuit | Integrated Circuit | - | Integrated Circuit | - | Integrated Circuit |
| Samacsys Package Category | Other | Other | - | SOT23 (6-Pin) | - | Small Outline Packages |
| Samacsys Footprint Name | SOT886 | SOT886 | - | SOT457 (SC-74) | - | SOT363 |
| Samacsys Released Date | 2019-11-12 07:41:52 | 2019-11-12 07:41:52 | - | 2017-06-26 13:54:15 | - | 2019-01-26 04:28:14 |
| Is Samacsys | N | N | - | N | - | N |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z | - | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N6 | R-PDSO-N6 | - | R-PDSO-G6 | - | R-PDSO-G6 |
| JESD-609代码 | e3 | e3 | - | e3 | - | e3 |
| 长度 | 1.45 mm | 1.45 mm | - | 2.9 mm | - | 2 mm |
| 逻辑集成电路类型 | BUFFER | BUFFER | - | BUFFER | - | BUFFER |
| 湿度敏感等级 | 1 | 1 | - | 1 | - | 1 |
| 功能数量 | 2 | 2 | - | 2 | - | 2 |
| 输入次数 | 1 | 1 | - | 1 | - | 1 |
| 端子数量 | 6 | 6 | - | 6 | - | 6 |
| 最高工作温度 | 125 °C | 125 °C | - | 125 °C | - | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | VSON | VSON | - | TSOP | - | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 | 260 | - | 260 | - | 260 |
| 传播延迟(tpd) | 13.1 ns | 13.1 ns | - | 13.1 ns | - | 13.1 ns |
| 座面最大高度 | 0.5 mm | 0.5 mm | - | 1.1 mm | - | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | - | 1.65 V | - | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | - | 1.8 V | - | 1.8 V |
| 表面贴装 | YES | YES | - | YES | - | YES |
| 技术 | CMOS | CMOS | - | CMOS | - | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | - | AUTOMOTIVE |
| 端子面层 | Tin (Sn) | Tin (Sn) | - | Tin (Sn) | - | Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | - | GULL WING | - | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | - | 0.95 mm | - | 0.65 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | - | 30 |
| 宽度 | 1 mm | 1 mm | - | 1.5 mm | - | 1.25 mm |
| Base Number Matches | 1 | 1 | - | 1 | - | 1 |
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