Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin XSON T/R
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Obsolete |
| HTS | 8542.39.00.01 |
| SVHC | Yes |
| Logic Family | LVC |
| Logic Function | Schmitt Trigger Buffer |
| Number of Elements per Chip | 2 |
| Number of Channels per Chip | 2 |
| Number of Inputs per Chip | 2 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 2 |
| Number of Output Enables per Chip | 0 |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 3.8(Typ)@2.7V|3.6(Typ)@3.3V|2.7(Typ)@5V |
| Absolute Propagation Delay Time (ns) | 13.1 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Maximum Low Level Output Current (mA) | 32 |
| Maximum High Level Output Current (mA) | -32 |
| Minimum Operating Supply Voltage (V) | 1.65 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Tolerant I/Os (V) | 5 |
| Typical Quiescent Current (uA) | 0.1 |
| Maximum Quiescent Current (uA) | 40 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum Power Dissipation (mW) | 300 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| 系列 Packaging | Tape and Reel |
| Supplier Package | XSON |
| Pin Count | 6 |
| Mounting | Surface Mount |
| Package Height | 0.46(Max) |
| Package Length | 1.05(Max) |
| Package Width | 1.05(Max) |
| PCB changed | 6 |

| 74LVC2G17GF,132 | 74LVC2G17GM,115 | 74LVC2G17GV,125 | 74LVC2G17GS,132 | 74LVC2G17GM,132 | 74LVC2G17GW,125 | |
|---|---|---|---|---|---|---|
| 描述 | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin XSON T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin XSON T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin TSOP T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin XSON T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin XSON T/R | Schmitt Trigger Buffer 2-CH Non-Inverting CMOS 6-Pin TSSOP T/R |
| Brand Name | - | Nexperia | Nexperia | - | Nexperia | Nexperia |
| 是否Rohs认证 | - | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | - | Nexperia | Nexperia | - | Nexperia | Nexperia |
| 零件包装代码 | - | SON | TSOP | - | SON | TSSOP |
| 包装说明 | - | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 | TSOP-6 | - | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 | PLASTIC, SC-88, SOT-363, 6 PIN |
| 针数 | - | 6 | 6 | - | 6 | 6 |
| 制造商包装代码 | - | SOT886 | SOT457 | - | SOT886 | SOT363 |
| Reach Compliance Code | - | compliant | compliant | - | compliant | compliant |
| Samacsys Confidence | - | 2 | 2 | - | 2 | 2 |
| Samacsys Status | - | Released | Released | - | Released | Released |
| Samacsys PartID | - | 865737 | 645117 | - | 796112 | 691034 |
| Samacsys Pin Count | - | 6 | 6 | - | 6 | 6 |
| Samacsys Part Category | - | Integrated Circuit | Integrated Circuit | - | Integrated Circuit | Integrated Circuit |
| Samacsys Package Category | - | Other | SOT23 (6-Pin) | - | Other | Small Outline Packages |
| Samacsys Footprint Name | - | SOT886 | SOT457 (SC-74) | - | SOT886 | SOT363 |
| Samacsys Released Date | - | 2019-11-12 07:41:52 | 2017-06-26 13:54:15 | - | 2019-11-12 07:41:52 | 2019-01-26 04:28:14 |
| Is Samacsys | - | N | N | - | N | N |
| 系列 | - | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | - | R-PDSO-N6 | R-PDSO-G6 | - | R-PDSO-N6 | R-PDSO-G6 |
| JESD-609代码 | - | e3 | e3 | - | e3 | e3 |
| 长度 | - | 1.45 mm | 2.9 mm | - | 1.45 mm | 2 mm |
| 逻辑集成电路类型 | - | BUFFER | BUFFER | - | BUFFER | BUFFER |
| 湿度敏感等级 | - | 1 | 1 | - | 1 | 1 |
| 功能数量 | - | 2 | 2 | - | 2 | 2 |
| 输入次数 | - | 1 | 1 | - | 1 | 1 |
| 端子数量 | - | 6 | 6 | - | 6 | 6 |
| 最高工作温度 | - | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | VSON | TSOP | - | VSON | TSSOP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | - | 260 | 260 | - | 260 | 260 |
| 传播延迟(tpd) | - | 13.1 ns | 13.1 ns | - | 13.1 ns | 13.1 ns |
| 座面最大高度 | - | 0.5 mm | 1.1 mm | - | 0.5 mm | 1.1 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 1.65 V | 1.65 V | - | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | - | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V |
| 表面贴装 | - | YES | YES | - | YES | YES |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | Tin (Sn) | Tin (Sn) | - | Tin (Sn) | Tin (Sn) |
| 端子形式 | - | NO LEAD | GULL WING | - | NO LEAD | GULL WING |
| 端子节距 | - | 0.5 mm | 0.95 mm | - | 0.5 mm | 0.65 mm |
| 端子位置 | - | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | - | 30 | 30 |
| 宽度 | - | 1 mm | 1.5 mm | - | 1 mm | 1.25 mm |
| Base Number Matches | - | 1 | 1 | - | 1 | 1 |
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