CAN 接口集成电路 CAN FD Transceiver
| 参数名称 | 属性值 |
| 厂商名称 | Microchip(微芯科技) |
| 产品种类 | CAN 接口集成电路 |
| 封装 / 箱体 | SOIC-8 |
| 系列 | MCP2544 |
| 封装 | Cut Tape |
| 封装 | Reel |
| 工厂包装数量 | 3300 |
| MCP2544WFDT-E/SN | MCP2544WFDT-E/MF | MCP2542WFD-E/SN | MCP2542FDT-H/MF | MCP2544WFDT-H/MNY | MCP2542WFDT-H/SN | MCP2544WFD-H/SN | MCP2544FDT-E/MF | MCP2544WFDT-H/MF | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | - | DFN-8 | SOP-8 | HVSON, | TDFN-8 | SOP-8 | SOP-8 | DFN-8 | DFN-8 |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Factory Lead Time | - | 13 weeks | 15 weeks | 5 weeks | 5 weeks | - | 13 weeks | 13 weeks | 13 weeks |
| JESD-30 代码 | - | S-PDSO-N8 | R-PDSO-G8 | S-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-N8 | S-PDSO-N8 |
| JESD-609代码 | - | e3 | e3 | e3 | e3 | - | - | e3 | e3 |
| 长度 | - | 3 mm | 4.9 mm | 3 mm | 3 mm | 4.9 mm | 4.9 mm | 3 mm | 3 mm |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | - | 125 °C | 125 °C | 150 °C | 150 °C | 150 °C | 150 °C | 125 °C | 150 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | HVSON | SOP | HVSON | HVSON | SOP | SOP | HVSON | HVSON |
| 封装形状 | - | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 |
| 筛选级别 | - | TS 16949 | TS 16949 | AEC-Q100; TS 16949 | AEC-Q100; TS 16949 | AEC-Q100; TS 16949 | AEC-Q100; TS 16949 | TS 16949 | AEC-Q100; TS 16949 |
| 座面最大高度 | - | 1 mm | 1.75 mm | 1 mm | 0.8 mm | 1.75 mm | 1.75 mm | 1 mm | 1 mm |
| 标称供电电压 | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | YES | YES | YES | YES | YES | YES | YES |
| 电信集成电路类型 | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) | - | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) |
| 端子形式 | - | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | - | 0.65 mm | 1.27 mm | 0.65 mm | 0.5 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | 40 | 30 |
| 宽度 | - | 3 mm | 3.9 mm | 3 mm | 2 mm | 3.9 mm | 3.9 mm | 3 mm | 3 mm |
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