CAN 接口集成电路 CAN FD Transceiver
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
包装说明 | SOP-8 |
Reach Compliance Code | compliant |
Factory Lead Time | 15 weeks |
Samacsys Description | CAN Interface IC CAN FD Transceiver |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 4.9 mm |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
筛选级别 | TS 16949 |
座面最大高度 | 1.75 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
电信集成电路类型 | INTERFACE CIRCUIT |
温度等级 | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3.9 mm |
MCP2542WFD-E/SN | MCP2544WFDT-E/MF | MCP2544WFDT-E/SN | MCP2542FDT-H/MF | MCP2544WFDT-H/MNY | MCP2542WFDT-H/SN | MCP2544WFD-H/SN | MCP2544FDT-E/MF | MCP2544WFDT-H/MF | |
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描述 | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver | CAN 接口集成电路 CAN FD Transceiver |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | SOP-8 | DFN-8 | - | HVSON, | TDFN-8 | SOP-8 | SOP-8 | DFN-8 | DFN-8 |
Reach Compliance Code | compliant | compliant | - | compliant | compliant | compliant | compliant | compliant | compliant |
Factory Lead Time | 15 weeks | 13 weeks | - | 5 weeks | 5 weeks | - | 13 weeks | 13 weeks | 13 weeks |
JESD-30 代码 | R-PDSO-G8 | S-PDSO-N8 | - | S-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-N8 | S-PDSO-N8 |
JESD-609代码 | e3 | e3 | - | e3 | e3 | - | - | e3 | e3 |
长度 | 4.9 mm | 3 mm | - | 3 mm | 3 mm | 4.9 mm | 4.9 mm | 3 mm | 3 mm |
功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 125 °C | - | 150 °C | 150 °C | 150 °C | 150 °C | 125 °C | 150 °C |
最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | HVSON | - | HVSON | HVSON | SOP | SOP | HVSON | HVSON |
封装形状 | RECTANGULAR | SQUARE | - | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | - | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 |
筛选级别 | TS 16949 | TS 16949 | - | AEC-Q100; TS 16949 | AEC-Q100; TS 16949 | AEC-Q100; TS 16949 | AEC-Q100; TS 16949 | TS 16949 | AEC-Q100; TS 16949 |
座面最大高度 | 1.75 mm | 1 mm | - | 1 mm | 0.8 mm | 1.75 mm | 1.75 mm | 1 mm | 1 mm |
标称供电电压 | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | - | YES | YES | YES | YES | YES | YES |
电信集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) | - | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) |
端子形式 | GULL WING | NO LEAD | - | NO LEAD | NO LEAD | GULL WING | GULL WING | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 0.65 mm | - | 0.65 mm | 0.5 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | 40 | 30 |
宽度 | 3.9 mm | 3 mm | - | 3 mm | 2 mm | 3.9 mm | 3.9 mm | 3 mm | 3 mm |
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