HCT SERIES, QUAD 2-INPUT OR GATE, PDIP14, PLASTIC, DIP-14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 系列 | HCT |
| JESD-30 代码 | R-PDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 19.18 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | OR GATE |
| 最大I（ol） | 0.004 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 25 ns |
| 传播延迟（tpd） | 25 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MM74HCT32N | MM74HCT32MX | MM74HCT32J | MM54HCT32J | MM74HCT32M | |
|---|---|---|---|---|---|
| 描述 | HCT SERIES, QUAD 2-INPUT OR GATE, PDIP14, PLASTIC, DIP-14 | IC HCT SERIES, QUAD 2-INPUT OR GATE, PDSO14, Gate | HCT SERIES, QUAD 2-INPUT OR GATE, CDIP14, CERAMIC, DIP-14 | HCT SERIES, QUAD 2-INPUT OR GATE, CDIP14, CERAMIC, DIP-14 | IC HCT SERIES, QUAD 2-INPUT OR GATE, PDSO14, Gate |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP14,.3 | SOP, | DIP, | DIP, DIP14,.3 | SOP, SOP14,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 系列 | HCT | HCT | HCT | HCT | HCT |
| JESD-30 代码 | R-PDIP-T14 | R-PDSO-G14 | R-GDIP-T14 | R-GDIP-T14 | R-PDSO-G14 |
| 长度 | 19.18 mm | 8.65 mm | 19.43 mm | 19.43 mm | 8.65 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 传播延迟（tpd） | 25 ns | 25 ns | 25 ns | 30 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.75 mm | 5.08 mm | 5.08 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 |
| 零件包装代码 | DIP | - | DIP | DIP | - |
| 针数 | 14 | - | 14 | 14 | - |
| JESD-609代码 | e0 | - | - | e0 | e0 |
| 封装等效代码 | DIP14,.3 | - | - | DIP14,.3 | SOP14,.25 |
| 电源 | 5 V | - | - | 5 V | 5 V |
| 施密特触发器 | NO | - | - | NO | NO |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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