IC HCT SERIES, QUAD 2-INPUT OR GATE, PDSO14, Gate
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | SOP, |
Reach Compliance Code | unknown |
系列 | HCT |
JESD-30 代码 | R-PDSO-G14 |
长度 | 8.65 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | OR GATE |
功能数量 | 4 |
输入次数 | 2 |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
传播延迟(tpd) | 25 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 3.9 mm |
MM74HCT32MX | MM74HCT32N | MM74HCT32J | MM54HCT32J | MM74HCT32M | |
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描述 | IC HCT SERIES, QUAD 2-INPUT OR GATE, PDSO14, Gate | HCT SERIES, QUAD 2-INPUT OR GATE, PDIP14, PLASTIC, DIP-14 | HCT SERIES, QUAD 2-INPUT OR GATE, CDIP14, CERAMIC, DIP-14 | HCT SERIES, QUAD 2-INPUT OR GATE, CDIP14, CERAMIC, DIP-14 | IC HCT SERIES, QUAD 2-INPUT OR GATE, PDSO14, Gate |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | SOP, | DIP, DIP14,.3 | DIP, | DIP, DIP14,.3 | SOP, SOP14,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
系列 | HCT | HCT | HCT | HCT | HCT |
JESD-30 代码 | R-PDSO-G14 | R-PDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-PDSO-G14 |
长度 | 8.65 mm | 19.18 mm | 19.43 mm | 19.43 mm | 8.65 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
功能数量 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | SOP | DIP | DIP | DIP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
传播延迟(tpd) | 25 ns | 25 ns | 25 ns | 30 ns | 25 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 5.08 mm | 5.08 mm | 5.08 mm | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 3.9 mm | 7.62 mm | 7.62 mm | 7.62 mm | 3.9 mm |
是否Rohs认证 | - | 不符合 | - | 不符合 | 不符合 |
零件包装代码 | - | DIP | DIP | DIP | - |
针数 | - | 14 | 14 | 14 | - |
JESD-609代码 | - | e0 | - | e0 | e0 |
封装等效代码 | - | DIP14,.3 | - | DIP14,.3 | SOP14,.25 |
电源 | - | 5 V | - | 5 V | 5 V |
施密特触发器 | - | NO | - | NO | NO |
端子面层 | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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