BZD27C100P: 产品描述Zener Diode, 100V V(Z), 6%, 0.8W, Silicon, Unidirectional, DO-219AA, LEAD FREE, PLASTIC, CASE M1F, SMA, 2 PIN; 产品类别二极管; 文件大小1MB，共3页; 制造商Fagor Electrónica; 标准

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BZD27C100P概述

Zener Diode, 100V V(Z), 6%, 0.8W, Silicon, Unidirectional, DO-219AA, LEAD FREE, PLASTIC, CASE M1F, SMA, 2 PIN

BZD27C100P规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Fagor Electrónica
零件包装代码	DO-219AA
包装说明	R-PDSO-F2
针数	2
制造商包装代码	CASE M1F
Reach Compliance Code	not_compliant
ECCN代码	EAR99
Is Samacsys	N
配置	SINGLE
二极管元件材料	SILICON
二极管类型	ZENER DIODE
JEDEC-95代码	DO-219AA
JESD-30 代码	R-PDSO-F2
JESD-609代码	e3
元件数量	1
端子数量	2
最高工作温度	175 °C
最低工作温度	-65 °C
封装主体材料	PLASTIC/EPOXY
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
峰值回流温度（摄氏度）	NOT SPECIFIED
极性	UNIDIRECTIONAL
最大功率耗散	0.8 W
认证状态	Not Qualified
标称参考电压	100 V
表面贴装	YES
技术	ZENER
端子面层	Tin (Sn)
端子形式	FLAT
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
最大电压容差	6%
工作测试电流	5 mA
Base Number Matches	1

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BZD27C Series

0.8 W Surface Mount Glass Passivated Zener Diode

Dimensions in mm.

CASE:

M1F (DO219AA)

Voltage

11 to 240 V

Power

0.8 W

• Silicon planar zener diodes

• Low profile surface-mount package

• Zener and surge curren specification

• Low leakage curren

• Excellent stability

• High temperature soldering:

260 °C / 10 seconds at terminals

MECHANICAL DATA

• Case: Sub SMA Plastic

•

Terminal: Pure tin plated lead free.

•

Packaging method: refer to package code

•

Marking code: as table

•

Weight: 10 mg (approx.)

XXX = Marking code

WW = Week code

Y = Year code

Maximun Ratings and Electrical Characteristics at 25 °C

SYMBOL

TYPE NUMBER

Forward Voltage

Power Dissipation

@ IF = 0.2A

TL = 80 °C

TA = 25 °C (Note 1)

Value

Unit

Ptot

ZSM

1.2

2.3

0.8

300

Non-Repetitive Peak Pulse Power Dissipation

100 µs square pulse (Note 2)

Non-Repetitive Peak Pulse Power Dissipation

10/1000 µs waveform (BZD27-C7V5P to BZD27-C100P)

(Note 2)

Non-Repetitive Peak Pulse Power Dissipation

RSM

150

RSM

- T

stg

Notes:

10/1000 µs waveform (BZD27-110P to BZD27-C200P)

(Note 2)

100

180

-65 to + 175

K /W

°C

Thermal Resistance Junction to Ambient Air

(Note 1)

Thermal Resistance Junction to lead

Operating and Storage Temperature Range

µmthick)

1.Mounted on Epoxy-Glass PCB with 3 x 3 mm Cu pads (

≥40

2. T

= 25

°C

Prior to surge

Sep - 08

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