EPROM, 256KX16, 250ns, CMOS, CDIP40
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Macronix |
| 包装说明 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 250 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-XDIP-T40 |
| JESD-609代码 | e0 |
| 内存密度 | 4194304 bit |
| 内存宽度 | 16 |
| 端子数量 | 40 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 3/3.3 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.00005 A |
| 最大压摆率 | 0.02 mA |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| MX27L4100DI-25 | MX27L4096PC-20 | MX27L4100PC-25 | MX27L4096DC-25 | MX27L4100PC-20 | MX27L4096QC-25 | MX27L4096DI-25 | MX27L4100MC-20 | MX27L4100DC-20 | MX27L4100MC-25 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EPROM, 256KX16, 250ns, CMOS, CDIP40 | OTP ROM, 256KX16, 200ns, CMOS, PDIP40 | OTP ROM, 256KX16, 250ns, CMOS, PDIP40 | EPROM, 256KX16, 250ns, CMOS, CDIP40 | OTP ROM, 256KX16, 200ns, CMOS, PDIP40 | OTP ROM, 256KX16, 250ns, CMOS, PQCC44 | EPROM, 256KX16, 250ns, CMOS, CDIP40 | OTP ROM, 256KX16, 200ns, CMOS, PDSO40 | EPROM, 256KX16, 200ns, CMOS, CDIP40 | OTP ROM, 256KX16, 250ns, CMOS, PDSO40 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix |
| 包装说明 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | SOP, SOP40,.56 | DIP, DIP40,.6 | SOP, SOP40,.56 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 250 ns | 200 ns | 250 ns | 250 ns | 200 ns | 250 ns | 250 ns | 200 ns | 200 ns | 250 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | R-XDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | R-XDIP-T40 | R-PDSO-G40 | R-XDIP-T40 | R-PDSO-G40 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 端子数量 | 40 | 40 | 40 | 40 | 40 | 44 | 40 | 40 | 40 | 40 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | QCCJ | DIP | SOP | DIP | SOP |
| 封装等效代码 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | SOP40,.56 | DIP40,.6 | SOP40,.56 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| 最大压摆率 | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA |
| 表面贴装 | NO | NO | NO | NO | NO | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | - | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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