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70121S55JGI8

产品描述Dual-Port SRAM
产品类别存储    存储   
文件大小200KB,共16页
制造商IDT (Integrated Device Technology)
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70121S55JGI8概述

Dual-Port SRAM

70121S55JGI8规格参数

参数名称属性值
厂商名称IDT (Integrated Device Technology)
Reach Compliance Codecompliant
Is SamacsysN
内存集成电路类型DUAL-PORT SRAM
Base Number Matches1

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HIGH-SPEED
2K x 9 DUAL-PORT
STATIC RAM
WITH BUSY & INTERRUPT
Features
IDT70121S/L
IDT70125S/L
High-speed access
– Commercial: 25/35/55ns (max.)
– Industrial: 35ns (max.)
Low-power operation
– IDT70121/70125S
Active: 675mW (typ.)
Standby: 5mW (typ.)
– IDT70121/70125L
Active: 675mW (typ.)
Standby: 1mW (typ.)
Fully asychronous operation from either port
MASTER IDT70121 easily expands data bus width to 18 bits or
more using SLAVE IDT70125 chip
On-chip port arbitration logic (IDT70121 only)
BUSY
output flag on Master;
BUSY
input on Slave
INT
flag for port-to-port communication
Battery backup operation—2V data retention
TTL-compatible, signal 5V (±10%) power supply
Available in 52-pin PLCC
Industrial temperature range (–40°C to +85°C) is available for
selected speeds
Green parts available, see ordering information
Functional Block Diagram
OE
L
CE
L
R/W
L
OE
R
CE
R
R/W
R
I/O
0L
- I/O
8L
I/O
Control
BUSY
L
A
10L
A
0L
(1,2)
I/O
0R
-I/O
8R
I/O
Control
BUSY
R
Address
Decoder
11
(1,2)
MEMORY
ARRAY
11
Address
Decoder
A
10R
A
0R
CE
L
OE
L
R/W
L
ARBITRATION
INTERRUPT
LOGIC
CE
R
OE
R
R/W
R
INT
L
(2)
INT
R
2654 drw 01
(2)
NOTES:
1. 70121 (MASTER):
BUSY
is non-tri-stated push-pull output.
70125 (SLAVE):
BUSY
is input.
2.
INT
is non-tri-stated push-pull output.
AUGUST 2014
1
©2014 Integrated Device Technology, Inc.
DSC 2654/13

70121S55JGI8相似产品对比

70121S55JGI8 70125S35JG8 70125S35JGI8 70125S35JGI 70125S35JG 70125L55JGI8 70125L55JGI 70121S55JG 70121S55JG8 70121S55JGI
描述 Dual-Port SRAM Dual-Port SRAM, 2KX9, 35ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-52 Dual-Port SRAM, 2KX9, 35ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-52 Dual-Port SRAM, 2KX9, 35ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-52 Dual-Port SRAM, 2KX9, 35ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-52 Dual-Port SRAM Dual-Port SRAM Dual-Port SRAM, 2KX9, 55ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-52 Dual-Port SRAM, 2KX9, 55ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-52 Dual-Port SRAM
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
Base Number Matches 1 1 1 1 1 1 1 1 1 1
是否Rohs认证 - 符合 符合 符合 符合 - - 符合 符合 -
包装说明 - QCCJ, LDCC52,.8SQ QCCJ, LDCC52,.8SQ QCCJ, LDCC52,.8SQ QCCJ, LDCC52,.8SQ - - QCCJ, LDCC52,.8SQ QCCJ, LDCC52,.8SQ -
最长访问时间 - 35 ns 35 ns 35 ns 35 ns - - 55 ns 55 ns -
I/O 类型 - COMMON COMMON COMMON COMMON - - COMMON COMMON -
JESD-30 代码 - S-PQCC-J52 S-PQCC-J52 S-PQCC-J52 S-PQCC-J52 - - S-PQCC-J52 S-PQCC-J52 -
JESD-609代码 - e3 e3 e3 e3 - - e3 e3 -
内存密度 - 18432 bit 18432 bit 18432 bit 18432 bit - - 18432 bit 18432 bit -
内存宽度 - 9 9 9 9 - - 9 9 -
湿度敏感等级 - 1 1 1 1 - - 1 1 -
功能数量 - 1 1 1 1 - - 1 1 -
端口数量 - 2 2 2 2 - - 2 2 -
端子数量 - 52 52 52 52 - - 52 52 -
字数 - 2048 words 2048 words 2048 words 2048 words - - 2048 words 2048 words -
字数代码 - 2000 2000 2000 2000 - - 2000 2000 -
工作模式 - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - - ASYNCHRONOUS ASYNCHRONOUS -
最高工作温度 - 70 °C 85 °C 85 °C 70 °C - - 70 °C 70 °C -
组织 - 2KX9 2KX9 2KX9 2KX9 - - 2KX9 2KX9 -
输出特性 - 3-STATE 3-STATE 3-STATE 3-STATE - - 3-STATE 3-STATE -
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 - QCCJ QCCJ QCCJ QCCJ - - QCCJ QCCJ -
封装等效代码 - LDCC52,.8SQ LDCC52,.8SQ LDCC52,.8SQ LDCC52,.8SQ - - LDCC52,.8SQ LDCC52,.8SQ -
封装形状 - SQUARE SQUARE SQUARE SQUARE - - SQUARE SQUARE -
封装形式 - CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER - - CHIP CARRIER CHIP CARRIER -
并行/串行 - PARALLEL PARALLEL PARALLEL PARALLEL - - PARALLEL PARALLEL -
峰值回流温度(摄氏度) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED -
电源 - 5 V 5 V 5 V 5 V - - 5 V 5 V -
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified - - Not Qualified Not Qualified -
最大待机电流 - 0.015 A 0.005 A 0.005 A 0.015 A - - 0.015 A 0.015 A -
最小待机电流 - 2 V 2 V 2 V 2 V - - 2 V 2 V -
最大压摆率 - 0.25 mA 0.21 mA 0.21 mA 0.25 mA - - 0.24 mA 0.24 mA -
最大供电电压 (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V - - 5.5 V 5.5 V -
最小供电电压 (Vsup) - 4.5 V 4.5 V 4.5 V 4.5 V - - 4.5 V 4.5 V -
标称供电电压 (Vsup) - 5 V 5 V 5 V 5 V - - 5 V 5 V -
表面贴装 - YES YES YES YES - - YES YES -
技术 - CMOS CMOS CMOS CMOS - - CMOS CMOS -
温度等级 - COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL - - COMMERCIAL COMMERCIAL -
端子面层 - Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed - - Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed -
端子形式 - J BEND J BEND J BEND J BEND - - J BEND J BEND -
端子节距 - 1.27 mm 1.27 mm 1.27 mm 1.27 mm - - 1.27 mm 1.27 mm -
端子位置 - QUAD QUAD QUAD QUAD - - QUAD QUAD -
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED -
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