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XHP50B-00-0000-0D0UG230G

产品描述LED XHP50.2 WARM WHITE SMD
产品类别光电子/LED   
文件大小2MB,共26页
制造商Cree(科瑞)
官网地址http://www.cree.com/
标准
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XHP50B-00-0000-0D0UG230G概述

LED XHP50.2 WARM WHITE SMD

XHP50B-00-0000-0D0UG230G规格参数

参数名称属性值
颜色白色,暖色
CCT(K)3000K 3 阶麦克亚当椭圆
85°C 时通量,电流 - 测试810 lm(780 lm ~ 840 lm)
电流 - 测试700mA
电压 - 正向(Vf)(典型值)11.2V
不同测试电流时的流明/瓦103 lm/W
CRI(高显色指数)90
电流 - 最大值1.5 A
视角120°
安装类型表面贴装
封装/外壳2020(5050 公制)
供应商器件封装2-SMD
大小/尺寸0.197" 长 x 0.197" 宽(5.00mm x 5.00mm)
高度 - 安装(最大值)0.143"(3.63mm)
封装热阻1.2°C/W

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CLD-DS150 Rev 0F
Product family data sheet
Cree
®
XLamp
®
XHP50.2 LEDs
ProDuCt DEsCriPtion
The XLamp XHP50.2 LeD is the next
generation of extreme High Power LeDs
that delivers the lowest3 system cost
through the best lumen density, reliability
and color consistency. Built on Cree’s
latest high-power LeD technology, the
XHP50.2 LeD improves the lumen density,
voltage
characteristics,
reliability
and
FEAturEs
Available in white, configurable to 6 V
or 12 V by PCB layout
Available in 5-step easyWhite
®
bins
at 3000 K to 5000 K CCT, 3-step
EasyWhite bins at 2700 K to 5000 K
and 2-step EasyWhite bins at 2700 K
to 4000 K CCT
Available in ANSI white bins at
3000 K to 7000 K CCT
Available in standard, 70-, 80-, and
90-minimum CRI options
Binned at 85 °C
Maximum drive current: 3000 mA
(6 V), 1500 mA (12 V)
Low thermal resistance: 1.2 °C/W
Wide viewing angle: 120°
Unlimited floor life at
≤ 30 ºC/85% RH
Reflow solderable - JEDEC
J-STD-020C
RoHS and ReACh compliant
UL
®
recognized component
(E349212)
tAbLE oF ContEnts
Characteristics ..............................................2
Flux Characteristics, easyWhite
®
Order
Codes and Bins .............................................3
Flux Characteristics, ANSI White Order
Codes and Bins .............................................5
Relative Spectral Power Distribution ...........7
Relative Flux vs. Junction Temperature
.......7
electrical Characteristics ..............................8
Relative Flux vs. Current ...............................9
Relative Chromaticity vs Current............... 10
Relative Chromaticity vs Temperature ...... 11
Typical Spatial Distribution........................ 11
Thermal Design .......................................... 12
Performance Groups – Luminous Flux..... 13
Performance Groups – Chromaticity........ 13
Cree’s easyWhite
®
Chromaticity Regions
Plotted on the 1931 CIe Curve ..................
16
Cree’s ANSI Cool White Kits Plotted on
ANSI Standard Chromaticity Regions ....... 17
Cree’s ANSI Warm and Neutral White Kits
Plotted on ANSI Standard Chromaticity
Regions ....................................................... 18
Bin and Order Code Formats ..................... 19
Reflow Soldering Characteristics
.............. 20
Notes .......................................................... 21
Mechanical Dimensions ............................ 23
Electrical Configuration
............................. 24
Tape and Reel ............................................. 25
Packaging ...................................................
26
optical performance of the XHP50 LeD in
the same 5.0  mm x 5.0  mm footprint. The
new XHP50.2 LeD provides an easy drop-in
upgrade to achieve higher system LPW
for lighting manufacturers with existing
XHP50 designs, eliminating redesign costs.
Its unparalleled lumen density and longer
lifetime at higher operating temperatures
also enables new and innovative lighting
designs at lower system costs.
WWW.CREE.Com/XLAmp
Copyright © 2016-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, XLamp
®
and
EasyWhite
®
are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL
®
and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
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