2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | White Electronic Designs Corporation |
包装说明 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
Reach Compliance Code | unknow |
最长访问时间 | 100 ns |
备用内存宽度 | 32 |
启动块 | BOTTOM |
命令用户界面 | NO |
数据轮询 | YES |
JESD-30 代码 | R-PBGA-B159 |
内存密度 | 134217728 bi |
内存集成电路类型 | FLASH MODULE |
内存宽度 | 64 |
功能数量 | 1 |
部门数/规模 | 8,64 |
端子数量 | 159 |
字数 | 2097152 words |
字数代码 | 2000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 2MX64 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA159,10X16,50 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3.3 V |
编程电压 | 3.3 V |
认证状态 | Not Qualified |
就绪/忙碌 | YES |
座面最大高度 | 2.2 mm |
部门规模 | 4K,32K |
最大待机电流 | 0.0004 A |
最大压摆率 | 0.18 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | BALL |
端子节距 | 1.27 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
切换位 | YES |
类型 | NOR TYPE |
写保护 | HARDWARE |
W72M64VK100BI | W72M64VK120BM | W72M64VK-XBX | W72M64VK100BM | W72M64VK90BM | W72M64VK90BI | W72M64VK90BC | W72M64VK120BI | W72M64VK120BC | W72M64VK100BC | |
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描述 | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package | 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | White Electronic Designs Corporation | White Electronic Designs Corporation | - | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |
包装说明 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | - | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
Reach Compliance Code | unknow | unknow | - | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
最长访问时间 | 100 ns | 120 ns | - | 100 ns | 90 ns | 90 ns | 90 ns | 120 ns | 120 ns | 100 ns |
备用内存宽度 | 32 | 32 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
启动块 | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
命令用户界面 | NO | NO | - | NO | NO | NO | NO | NO | NO | NO |
数据轮询 | YES | YES | - | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | R-PBGA-B159 | R-PBGA-B159 | - | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 | R-PBGA-B159 |
内存密度 | 134217728 bi | 134217728 bi | - | 134217728 bi | 134217728 bi | 134217728 bi | 134217728 bi | 134217728 bi | 134217728 bi | 134217728 bi |
内存集成电路类型 | FLASH MODULE | FLASH MODULE | - | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
内存宽度 | 64 | 64 | - | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
部门数/规模 | 8,64 | 8,64 | - | 8,64 | 8,64 | 8,64 | 8,64 | 8,64 | 8,64 | 8,64 |
端子数量 | 159 | 159 | - | 159 | 159 | 159 | 159 | 159 | 159 | 159 |
字数 | 2097152 words | 2097152 words | - | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
字数代码 | 2000000 | 2000000 | - | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 125 °C | - | 125 °C | 125 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
最低工作温度 | -40 °C | -55 °C | - | -55 °C | -55 °C | -40 °C | - | -40 °C | - | - |
组织 | 2MX64 | 2MX64 | - | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 | 2MX64 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | - | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
封装等效代码 | BGA159,10X16,50 | BGA159,10X16,50 | - | BGA159,10X16,50 | BGA159,10X16,50 | BGA159,10X16,50 | BGA159,10X16,50 | BGA159,10X16,50 | BGA159,10X16,50 | BGA159,10X16,50 |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | - | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
并行/串行 | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
编程电压 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
就绪/忙碌 | YES | YES | - | YES | YES | YES | YES | YES | YES | YES |
座面最大高度 | 2.2 mm | 2.2 mm | - | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm | 2.2 mm |
部门规模 | 4K,32K | 4K,32K | - | 4K,32K | 4K,32K | 4K,32K | 4K,32K | 4K,32K | 4K,32K | 4K,32K |
最大待机电流 | 0.0004 A | 0.0004 A | - | 0.0004 A | 0.0004 A | 0.0004 A | 0.0004 A | 0.0004 A | 0.0004 A | 0.0004 A |
最大压摆率 | 0.18 mA | 0.18 mA | - | 0.18 mA | 0.18 mA | 0.18 mA | 0.18 mA | 0.18 mA | 0.18 mA | 0.18 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | - | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | - | MILITARY | MILITARY | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
端子形式 | BALL | BALL | - | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
切换位 | YES | YES | - | YES | YES | YES | YES | YES | YES | YES |
类型 | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
写保护 | HARDWARE | HARDWARE | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
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