IC MCU 8BIT 24KB OTP 80QFP
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFP |
| 包装说明 | QFP, QFP80,.68SQ |
| 针数 | 80 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 具有ADC | YES |
| 地址总线宽度 | 16 |
| 位大小 | 8 |
| CPU系列 | 6800 |
| 最大时钟频率 | 16 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | S-PQFP-G80 |
| JESD-609代码 | e0 |
| 长度 | 14 mm |
| 湿度敏感等级 | 2 |
| I/O 线路数量 | 62 |
| 端子数量 | 80 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP80,.68SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 220 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 768 |
| ROM（单词） | 24576 |
| ROM可编程性 | OTPROM |
| 座面最大高度 | 2.45 mm |
| 速度 | 4 MHz |
| 最大压摆率 | 50 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | HCMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| MC68HC711K4CFU4 | MC68HC11K1CFN4 | MC68HC711K4CFN4 | MCHC711KS2MFNE4 | MC711K4VFUE4R | MC711K4VFNE4 | MC68HC11KS2FN | MC68HC11KS2PU | MC68HC11K1 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC MCU 8BIT 24KB OTP 80QFP | IC MCU 8BIT ROMLESS 84PLCC | IC MCU 8BIT 24KB OTP 84PLCC | IC MCU 8BIT 32KB OTP 68PLCC | IC MCU 8BIT 24KB OTP 80QFP | IC MCU 8BIT 24KB OTP 84PLCC | 8-BIT, MROM, 4MHz, MICROCONTROLLER, PQCC68, PLASTIC, LCC-68 | 8-BIT, MROM, 4MHz, MICROCONTROLLER, PQFP80, 14 X 14 MM, 1.40 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-80 | MICROCONTROLLER |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 符合 | - | 符合 | 不符合 | 不符合 | - |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | QFP | LCC | LCC | - | - | - | LCC | QFP | - |
| 包装说明 | QFP, QFP80,.68SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC84,1.2SQ | - | - | - | PLASTIC, LCC-68 | 14 X 14 MM, 1.40 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-80 | , |
| 针数 | 80 | 84 | 84 | - | - | - | 68 | 80 | - |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | unknown | - | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | - | - | EAR99 | EAR99 | - |
| 具有ADC | YES | YES | YES | - | - | - | YES | YES | - |
| 地址总线宽度 | 16 | 16 | 16 | - | - | - | 16 | 16 | - |
| 位大小 | 8 | 8 | 8 | - | - | - | 8 | 8 | - |
| CPU系列 | 6800 | 6800 | 6800 | - | - | - | 6800 | 6800 | - |
| 最大时钟频率 | 16 MHz | 16 MHz | 16 MHz | - | - | - | 16 MHz | 16 MHz | - |
| DAC 通道 | NO | NO | NO | - | - | - | NO | NO | - |
| DMA 通道 | NO | NO | NO | - | - | - | NO | NO | - |
| 外部数据总线宽度 | 8 | 8 | 8 | - | - | - | 8 | 8 | - |
| JESD-30 代码 | S-PQFP-G80 | S-PQCC-J84 | S-PQCC-J84 | - | - | - | S-PQCC-J68 | S-PQFP-G80 | - |
| JESD-609代码 | e0 | e0 | e0 | - | - | - | e0 | e0 | - |
| 长度 | 14 mm | 29.285 mm | 29.285 mm | - | - | - | 24.2062 mm | 14 mm | - |
| 湿度敏感等级 | 2 | 4 | 4 | - | - | - | 3 | 3 | - |
| I/O 线路数量 | 62 | 62 | 62 | - | - | - | 51 | 51 | - |
| 端子数量 | 80 | 84 | 84 | - | - | - | 68 | 80 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | - | - | 70 °C | 70 °C | - |
| PWM 通道 | YES | YES | YES | - | - | - | YES | YES | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | QFP | QCCJ | QCCJ | - | - | - | QCCJ | LQFP | - |
| 封装等效代码 | QFP80,.68SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | - | - | - | LDCC68,1.0SQ | LDCC68,1.0SQ | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | - | - | - | SQUARE | SQUARE | - |
| 封装形式 | FLATPACK | CHIP CARRIER | CHIP CARRIER | - | - | - | CHIP CARRIER | FLATPACK, LOW PROFILE | - |
| 峰值回流温度（摄氏度） | 220 | 220 | 220 | - | - | - | 220 | 220 | - |
| 电源 | 5 V | 5 V | 5 V | - | - | - | 5 V | 5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | - | Not Qualified | Not Qualified | - |
| RAM（字节） | 768 | 768 | 768 | - | - | - | 1024 | 1024 | - |
| ROM可编程性 | OTPROM | MROM | OTPROM | - | - | - | MROM | MROM | - |
| 座面最大高度 | 2.45 mm | 4.57 mm | 4.57 mm | - | - | - | 4.572 mm | 1.6 mm | - |
| 速度 | 4 MHz | 4 MHz | 4 MHz | - | 4MHz | - | 4 MHz | 4 MHz | - |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | - | - | - | 5.5 V | 5.5 V | - |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | - | - | - | 4.5 V | 4.5 V | - |
| 标称供电电压 | 5 V | 5 V | 5 V | - | - | - | 5 V | 5 V | - |
| 表面贴装 | YES | YES | YES | - | - | - | YES | YES | - |
| 技术 | HCMOS | HCMOS | HCMOS | - | - | - | HCMOS | HCMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | - | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | GULL WING | J BEND | J BEND | - | - | - | J BEND | GULL WING | - |
| 端子节距 | 0.65 mm | 1.27 mm | 1.27 mm | - | - | - | 1.27 mm | 0.65 mm | - |
| 端子位置 | QUAD | QUAD | QUAD | - | - | - | QUAD | QUAD | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | - | - | - | 30 | 30 | - |
| 宽度 | 14 mm | 29.285 mm | 29.285 mm | - | - | - | 24.2062 mm | 14 mm | - |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - | - | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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