IC BUFFER INVERT 5.5V 16DIP
参数名称 | 属性值 |
Brand Name | NXP Semiconductor |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | DIP |
包装说明 | DIP, DIP16,.3 |
针数 | 16 |
制造商包装代码 | SOT38-4 |
Reach Compliance Code | compliant |
其他特性 | WITH DUAL OUTPUT ENABLE |
控制类型 | ENABLE LOW |
系列 | HCT |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e4 |
长度 | 21.6 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.006 A |
位数 | 6 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 36 ns |
传播延迟(tpd) | 36 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.7 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7.62 mm |
74HCT366N,652 | 935283209112 | 74HC366N,652 | 935283209118 | 935283208112 | 935283208118 | |
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描述 | IC BUFFER INVERT 5.5V 16DIP | HCT SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | IC BUFFER INVERT 6V 16DIP | HCT SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | HC/UH SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | HC/UH SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 |
包装说明 | DIP, DIP16,.3 | TSSOP, | DIP, DIP16,.3 | TSSOP, | TSSOP, | TSSOP, |
Reach Compliance Code | compliant | unknown | compliant | unknown | unknown | unknown |
其他特性 | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
系列 | HCT | HCT | HC/UH | HCT | HC/UH | HC/UH |
JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
长度 | 21.6 mm | 5 mm | 21.6 mm | 5 mm | 5 mm | 5 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 6 | 6 | 6 | 6 | 6 | 6 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | TSSOP | DIP | TSSOP | TSSOP | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 36 ns | 36 ns | 150 ns | 36 ns | 150 ns | 150 ns |
座面最大高度 | 4.7 mm | 1.1 mm | 4.7 mm | 1.1 mm | 1.1 mm | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 6 V | 5.5 V | 6 V | 6 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 2 V | 4.5 V | 2 V | 2 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子节距 | 2.54 mm | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 4.4 mm | 7.62 mm | 4.4 mm | 4.4 mm | 4.4 mm |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | - |
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