IC BUFFER NON-INVERT 5.5V 14DIP
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| 制造商包装代码 | SOT27-1 |
| Reach Compliance Code | compliant |
| 其他特性 | TYPICAL VOLP < 0.8V AT VCC = 3.3V, TA = 25 DEGREE C |
| 控制类型 | ENABLE LOW |
| 系列 | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDIP-T14 |
| JESD-609代码 | e4 |
| 长度 | 19.025 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.008 A |
| 位数 | 1 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 18 ns |
| 传播延迟（tpd） | 31 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.62 mm |
| 74LV125N,112 | 935174350118 | 935174350112 | 935063160112 | 935063170112 | 935063170118 | 74LV125D,112 | 74LV125PW,118 | 74LV125DB,112 | 74LV125DB,118 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC BUFFER NON-INVERT 5.5V 14DIP | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDIP14, 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14 | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 | IC BUFFER NON-INVERT 5.5V 14SO | IC BUF NON-INVERT 5.5V 14TSSOP | IC BUF NON-INVERT 5.5V 14SSOP | IC BUF NON-INVERT 5.5V 14SSOP |
| 包装说明 | DIP, DIP14,.3 | TSSOP, | TSSOP, | DIP, | SOP, | SOP, | SOP, SOP14,.25 | TSSOP, TSSOP14,.25 | SSOP, SSOP14,.3 | SSOP, SSOP14,.3 |
| Reach Compliance Code | compliant | unknow | unknow | unknown | unknown | unknown | compliant | compliant | compliant | compliant |
| 系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 19.025 mm | 5 mm | 5 mm | 19.025 mm | 8.65 mm | 8.65 mm | 8.65 mm | 5 mm | 6.2 mm | 6.2 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | TSSOP | TSSOP | DIP | SOP | SOP | SOP | TSSOP | SSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 传播延迟（tpd） | 31 ns | 31 ns | 31 ns | 31 ns | 31 ns | 31 ns | 31 ns | 31 ns | 31 ns | 31 ns |
| 座面最大高度 | 4.2 mm | 1.1 mm | 1.1 mm | 4.2 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.1 mm | 2 mm | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 0.65 mm | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 4.4 mm | 4.4 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 4.4 mm | 5.3 mm | 5.3 mm |
| 厂商名称 | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
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