IC FF D-TYPE SNGL 8BIT 20TSSOP
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP2 |
| 包装说明 | TSSOP, TSSOP20,.25 |
| 针数 | 20 |
| 制造商包装代码 | SOT360-1 |
| Reach Compliance Code | compliant |
| 其他特性 | WITH HOLD MODE |
| 系列 | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 6.5 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 20000000 Hz |
| 最大I（ol） | 0.008 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP20,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 36 ns |
| 传播延迟（tpd） | 36 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 4.4 mm |
| 最小 fmax | 20 MHz |
| 74LV377PW,118 | 74LV377PW,112 | 74LV377N,112 | 74LV377DB,118 | 74LV377DB,112 | 74LV377D,118 | 74LV377D,112 | 74LV377PWDH-T | 74LV377PWDH | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC FF D-TYPE SNGL 8BIT 20TSSOP | IC FF D-TYPE SNGL 8BIT 20TSSOP | IC FF D-TYPE SNGL 8BIT 20DIP | IC FF D-TYPE SNGL 8BIT 20SSOP | IC FF D-TYPE SNGL 8BIT 20SSOP | IC FF D-TYPE SNGL 8BIT 20SO | IC FF D-TYPE SNGL 8BIT 20SO | IC LV/LV-A/LVX/H SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, FF/Latch | IC LV/LV-A/LVX/H SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, PLASTIC, TSSOP-20, FF/Latch |
| 包装说明 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | DIP, DIP20,.3 | SSOP, SSOP20,.3 | SSOP, SSOP20,.3 | SOP, | SOP, SOP20,.4 | TSSOP, | TSSOP, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | unknown | compliant | unknown | unknown |
| 其他特性 | WITH HOLD MODE | WITH HOLD MODE | WITH HOLD MODE | WITH HOLD MODE | WITH HOLD MODE | WITH HOLD MODE | WITH HOLD MODE | WITH HOLD MODE | WITH HOLD MODE |
| 系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| 长度 | 6.5 mm | 6.5 mm | 26.73 mm | 7.2 mm | 7.2 mm | 12.8 mm | 12.8 mm | 6.5 mm | 6.5 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | DIP | SSOP | SSOP | SOP | SOP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 4.2 mm | 2 mm | 2 mm | 2.65 mm | 2.65 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 4.4 mm | 4.4 mm | 7.62 mm | 5.3 mm | 5.3 mm | 7.5 mm | 7.5 mm | 4.4 mm | 4.4 mm |
| 最小 fmax | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - | - |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
| 零件包装代码 | TSSOP2 | TSSOP2 | DIP | SSOP2 | SSOP2 | SOP | SOP | - | TSSOP |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - | 20 |
| 制造商包装代码 | SOT360-1 | SOT360-1 | SOT146-1 | SOT339-1 | SOT339-1 | SOT163-1 | SOT163-1 | - | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | - | e4 |
| 最大频率@ Nom-Sup | 20000000 Hz | 20000000 Hz | 20000000 Hz | 20000000 Hz | 20000000 Hz | - | 20000000 Hz | - | - |
| 最大I（ol） | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | - | 0.008 A | - | - |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 | - | - |
| 封装等效代码 | TSSOP20,.25 | TSSOP20,.25 | DIP20,.3 | SSOP20,.3 | SSOP20,.3 | - | SOP20,.4 | - | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED | 260 | - | - |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | - | - |
| Prop。Delay @ Nom-Sup | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns | - | 36 ns | - | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | NOT SPECIFIED | 30 | - | - |
嵌入式系统
实时操作系统RTOS
FPGA/CPLD
FPGA/CPLD
求职招聘
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
