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MX25L12845GMI-10G: 产品描述IC FLASH 128MBIT; 产品类别存储存储; 文件大小2MB，共117页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx; 标准

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MX25L12845GMI-10G概述

IC FLASH 128MBIT

MX25L12845GMI-10G规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Macronix
零件包装代码	SOIC
包装说明	SOP,
针数	16
Reach Compliance Code	unknown
Factory Lead Time	16 weeks
其他特性	CAN BE ORGANISED AS 128 MBIT X 1
备用内存宽度	2
最大时钟频率 (fCLK)	104 MHz
JESD-30 代码	R-PDSO-G16
JESD-609代码	e3
长度	10.3 mm
内存密度	134217728 bit
内存集成电路类型	FLASH
内存宽度	4
湿度敏感等级	3
功能数量	1
端子数量	16
字数	33554432 words
字数代码	32000000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	32MX4
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	260
编程电压	3 V
座面最大高度	2.65 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	40
宽度	7.52 mm

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MX25L12845G

3V, 128M-BIT [x 1/x 2/x 4]

CMOS MXSMIO

(SERIAL MULTI I/O)

FLASH MEMORY

Key Features

• Protocol Support - Single I/O, Dual I/O and Quad I/O

• Support DTR (Double Transfer Rate) Mode

• Support clock frequency up to 133MHz

MX25L12845G

Contents

1. FEATURES .............................................................................................................................................................. 5

2. GENERAL DESCRIPTION ..................................................................................................................................... 6

Table 1. Read performance Comparison ....................................................................................................6

3. PIN CONFIGURATIONS ......................................................................................................................................... 7

4. PIN DESCRIPTION .................................................................................................................................................. 7

5. BLOCK DIAGRAM................................................................................................................................................... 8

6. DATA PROTECTION................................................................................................................................................ 9

Table 2. Protected Area Sizes ...................................................................................................................10

Table 3. 4K-bit Secured OTP Definition

.................................................................................................... 11

7. Memory Organization ........................................................................................................................................... 12

Table 4. Memory Organization ..................................................................................................................12

8. DEVICE OPERATION ............................................................................................................................................ 13

8-1. Quad Peripheral Interface (QPI) Read Mode .......................................................................................... 15

9. COMMAND DESCRIPTION ................................................................................................................................... 16

9-1.

9-2.

9-3.

9-4.

9-5.

9-6.

9-7.

9-8.

9-9.

Table 5. Command Set..............................................................................................................................16

Write Enable (WREN) .............................................................................................................................. 20

Write Disable (WRDI)............................................................................................................................... 21

Factory Mode Enable (FMEN) ................................................................................................................. 22

Read Identification (RDID)

....................................................................................................................... 23

Release from Deep Power-down (RDP), Read Electronic Signature (RES) ........................................... 24

Read Electronic Manufacturer ID & Device ID (REMS) ........................................................................... 26

QPI ID Read (QPIID) ............................................................................................................................... 27

Table 6. ID Definitions

..............................................................................................................................27

Read Status Register (RDSR) ................................................................................................................. 28

Read Configuration Register (RDCR)

...................................................................................................... 29

Table 7. Status Register ............................................................................................................................32

Table 8. Configuration

Register .................................................................................................................33

Table 9. Output Driver Strength Table .......................................................................................................34

Table 10. Dummy Cycle and Frequency Table (MHz) ...............................................................................34

Write Status Register (WRSR)................................................................................................................. 35

Table 11. Protection Modes .......................................................................................................................36

Read Data Bytes (READ) ........................................................................................................................ 39

Read Data Bytes at Higher Speed (FAST_READ) .................................................................................. 40

Dual Output Read Mode (DREAD) .......................................................................................................... 42

2 x I/O Read Mode (2READ) ................................................................................................................... 43

Quad Read Mode (QREAD) .................................................................................................................... 44

4 x I/O Read Mode (4READ) ................................................................................................................... 45

4 x I/O Double Transfer Rate Read Mode (4DTRD) ................................................................................ 47

Preamble Bit ........................................................................................................................................... 49

Burst Read ............................................................................................................................................... 53

Performance Enhance Mode ................................................................................................................... 54

Sector Erase (SE) .................................................................................................................................... 57

Block Erase (BE32K) ............................................................................................................................... 58

Block Erase (BE) ..................................................................................................................................... 59

Rev. 1.6, October 05, 2017

9-10.

9-11.

9-12.

9-13.

9-14.

9-15.

9-16.

9-17.

9-18.

9-19.

9-20.

9-21.

9-22.

9-23.

P/N: PM2145

MX25L12845G

Chip Erase (CE) ....................................................................................................................................... 60

Page Program (PP) ................................................................................................................................. 61

4 x I/O Page Program (4PP) .................................................................................................................... 63

Deep Power-down (DP) ........................................................................................................................... 64

Write Security Register (WRSCUR)......................................................................................................... 65

Read Security Register (RDSCUR) ......................................................................................................... 66

Enter Secured OTP (ENSO) .................................................................................................................... 67

Exit Secured OTP (EXSO) ....................................................................................................................... 67

Table 12. Security Register Definition

.......................................................................................................68

9-32. Write Protection Selection (WPSEL)........................................................................................................ 69

9-33. Advanced Sector Protection .................................................................................................................... 71

9-33-1. Lock Register ...............................................................................................................................72

9-33-2. Solid Protection Bits ......................................................................................................................73

9-33-3. Dynamic Protection Bits ................................................................................................................75

9-33-4. Temporary Un-protect Solid write protect bit (USPB) ...................................................................76

9-33-5. Gang Block Lock/Unlock (GBLK/GBULK).....................................................................................76

9-33-6. Sector Protection States Summary Table .....................................................................................76

9-34. Program/Erase Suspend/Resume ........................................................................................................... 77

9-35. Erase Suspend ........................................................................................................................................ 77

9-36. Program Suspend .................................................................................................................................... 77

9-37. Write-Resume .......................................................................................................................................... 79

9-38. No Operation (NOP) ................................................................................................................................ 79

9-39. Software Reset (Reset-Enable (RSTEN) and Reset (RST)) ................................................................... 79

9-40. Read SFDP Mode (RDSFDP).................................................................................................................. 81

Table 13. Signature and Parameter Identification Data Values

................................................................82

Table 14. Parameter Table (0): JEDEC Flash Parameter Tables ..............................................................84

Table 15. Parameter Table (1): 4-Byte Instruction Tables .........................................................................91

Table 16. Parameter Table (2): Macronix Flash Parameter Tables ...........................................................93

10. RESET.................................................................................................................................................................. 95

Table 17. Reset Timing-(Power On) ..........................................................................................................95

Table 18. Reset Timing-(Other Operation) ................................................................................................95

9-24.

9-25.

9-26.

9-27.

9-28.

9-29.

9-30.

9-31.

P/N: PM2145

Rev. 1.6, October 05, 2017

MX25L12845G

11. POWER-ON STATE ............................................................................................................................................. 96

12. ELECTRICAL SPECIFICATIONS ........................................................................................................................ 97

Table 19. ABSOLUTE MAXIMUM RATINGS ............................................................................................97

Table 20. CAPACITANCE TA = 25°C, f = 1.0 MHz ....................................................................................97

Table 21. DC CHARACTERISTICS (Temperature = -40°C to 85°C,

VCC = 2.7V - 3.6V)

........................99

Table 22. AC CHARACTERISTICS (Temperature = -40°C to 85°C,

VCC = 2.7V - 3.6V)

.....................100

13. OPERATING CONDITIONS ............................................................................................................................... 102

Table 23. Power-Up/Down Voltage and Timing

......................................................................................104

13-1. INITIAL DELIVERY STATE

.................................................................................................................... 104

14. ERASE AND PROGRAMMING PERFORMANCE ............................................................................................ 105

15. ERASE AND PROGRAMMING PERFORMANCE (Factory Mode) ................................................................ 105

16. DATA RETENTION ............................................................................................................................................ 106

17. LATCH-UP CHARACTERISTICS ...................................................................................................................... 106

18. ORDERING INFORMATION .............................................................................................................................. 107

19. PART NAME DESCRIPTION ............................................................................................................................. 108

20. PACKAGE INFORMATION ................................................................................................................................ 109

20-1. 16-PIN SOP (300mil) ............................................................................................................................. 109

20-2. 8-pins SOP (200mil)................................................................................................................................110

20-3. 8-land WSON (8x6mm)........................................................................................................................... 111

20-4. 8-land WSON (6x5mm)...........................................................................................................................112

20-5. 24-Ball BGA (4x6 ball array) ...................................................................................................................113

20-6. 24-Ball BGA (5x5 ball array) ...................................................................................................................114

21. REVISION HISTORY ......................................................................................................................................... 115

P/N: PM2145

Rev. 1.6, October 05, 2017

MX25L12845GMI-10G相似产品对比

	MX25L12845GMI-10G	MX25L12845GMI-08G	MX25L12845GZ2I-08G	MX25L12845GXCI-08G	MX25L12845GXDI-08G	MX25L12845GZNI-08G	MX25L12845GZNI-10G	MX25L12845GM2I-08G	MX25L12845GM2I-10G
描述	IC FLASH 128MBIT	IC FLASH 128MBIT	IC FLASH 128MBIT	IC FLASH 128MBIT	IC FLASH 128MBIT	IC FLASH 128MBIT	IC FLASH 128MBIT	IC FLASH 128MBIT	IC FLASH 128MBIT
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
包装说明	SOP,	SOP,	HVSON,	TBGA,	TBGA,	HVSON,	HVSON,	SOP,	SOP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Factory Lead Time	16 weeks	16 weeks	16 weeks	16 weeks	16 weeks	16 weeks	16 weeks	16 weeks	16 weeks
其他特性	CAN BE ORGANISED AS 128 MBIT X 1	CAN BE ORGANISED AS 128 M X 1	CAN BE ORGANISED AS 128 M X 1	CAN BE ORGANISED AS 128 M X 1	CAN BE ORGANISED AS 128 M X 1	CAN BE ORGANISED AS 128 M X 1	CAN BE ORGANISED AS 64 MBIT X 1	CAN BE ORGANISED AS 128 M X 1	ALSO CONFIGURABLE AS 128M X 1
备用内存宽度	2	2	2	2	2	2	2	2	2
最大时钟频率 (fCLK)	104 MHz	120 MHz	120 MHz	120 MHz	120 MHz	120 MHz	104 MHz	120 MHz	104 MHz
JESD-30 代码	R-PDSO-G16	R-PDSO-G16	R-PDSO-N8	R-PBGA-B24	R-PBGA-B24	R-PDSO-N8	R-PDSO-N8	R-PDSO-G8	R-PDSO-G8
长度	10.3 mm	10.3 mm	8 mm	8 mm	8 mm	6 mm	8 mm	5.28 mm	5.28 mm
内存密度	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	4	4	4	4	4	4	4	4	4
功能数量	1	1	1	1	1	1	1	1	1
端子数量	16	16	8	24	24	8	8	8	8
字数	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words
字数代码	32000000	32000000	32000000	32000000	32000000	32000000	32000000	32000000	32000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	32MX4	32MX4	32MX4	32MX4	32MX4	32MX4	32MX4	32MX4	32MX4
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	SOP	HVSON	TBGA	TBGA	HVSON	HVSON	SOP	SOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED	260
编程电压	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
座面最大高度	2.65 mm	2.65 mm	0.8 mm	1.2 mm	1.2 mm	0.8 mm	0.8 mm	2.16 mm	2.16 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	NO LEAD	BALL	BALL	NO LEAD	NO LEAD	GULL WING	GULL WING
端子节距	1.27 mm	1.27 mm	1.27 mm	1 mm	1 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	BOTTOM	BOTTOM	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	40	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	40	NOT SPECIFIED	40
宽度	7.52 mm	7.52 mm	6 mm	6 mm	6 mm	5 mm	6 mm	5.23 mm	5.23 mm
Base Number Matches	-	-	1	-	1	-	1	1	1

MX25L12845GMI-10G

MX25L12845GMI-10G概述

MX25L12845GMI-10G规格参数

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